SCLS233S october   1995  – july 2023 SN54AHCT245 , SN74AHCT245

PRODMIX  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 5
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Noise Characteristics
    8. 6.8 Operating Characteristics
    9. 6.9 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Receiving Notification of Documentation Updates
    2. 10.2 Support Resources
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 Glossary
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) SN74AHCT245 UNIT
DB DGV DW N NS PW RGY RKS DGS
20 PINS
RθJA Junction-to-ambient thermal resistance 113.1 116.1 96.2 51.5 77.1 122.3 35.1 67.7 118.4 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 72.9 31.3 63.6 38.2 43.6 64.8 43.3 72.4 57.7
RθJB Junction-to-board thermal resistance 67.9 57.6 64.7 32.4 44.6 73.3 12.9 40.4 73.1
ψJT Junction-to-top characterization parameter 39.3 1.0 40.5 24.6 17.2 19 0.9 10.3 5.7
ψJB Junction-to-board characterization parameter 67.5 56.9 64.3 32.3 44.2 73 12.9 40.4 72.7
RθJC(bot) Junction-to-case (bottom) thermal resistance n/a n/a n/a n/a n/a n/a 7.9 24.1 n/a
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.