SCLS081I December   1982  – September 2021 SN54HC08 , SN74HC08

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics - 74
    6. 6.6  Electrical Characteristics - 54
    7. 6.7  Switching Characteristics - 74
    8. 6.8  Switching Characteristics - 54
    9. 6.9  Operating Characteristics
    10. 6.10 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Balanced CMOS Push-Pull Outputs
      2. 8.3.2 Standard CMOS Inputs
      3. 8.3.3 Clamp Diode Structure
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 Power Considerations
        2. 9.2.1.2 Input Considerations
        3. 9.2.1.3 Output Considerations
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Support Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • J|14
  • W|14
Thermal pad, mechanical data (Package|Pins)
Orderable Information

3 Description

This device contains four independent 2-input AND gates. Each gate performs the Boolean function Y = A ● B in positive logic.

Device Information
PART NUMBER PACKAGE(1) BODY SIZE (NOM)
SN74HC08D SOIC (14) 8.65 mm × 3.90 mm
SN74HC08DB SSOP (14) 6.30 mm × 5.30 mm
SN74HC08N PDIP (14) 19.34 mm × 6.35 mm
SN74HC08N SO (14) 10.30 mm × 5.30 mm
SN74HC08PW TSSOP (14) 5.00 mm × 4.40 mm
SN54HC08 LCCC (14) 1.83 mm × 8.89 mm
CDIP (14) 19.56 mm × 6.67 mm
CFP (14) 9.21 mm × 5.97 mm
(1) For all available packages, see the orderable addendum at the end of the data sheet.
GUID-08317FED-8A3C-48F9-A09D-7E0ED8FC889E-low.gifFunctional pinout