SCLS099I December   1982  – September 2024 SN54HC112 , SN74HC112

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 Recommended Operating Conditions #GUID-2EBD0632-9121-4D73-88A3-4D53587EF83D/GUID-D459A9EC-CCFD-4DD4-8D23-57A07F876135
    3. 5.3 Thermal Information
    4. 5.4 Electrical Characteristics
    5. 5.5 Timing Requirements
    6. 5.6 Switching Characteristics
    7. 5.7 Operating Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Power Supply Recommendations
    2. 8.2 Layout
      1. 8.2.1 Layout Guidelines
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • W|16
  • J|16
  • FK|20
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.3 Thermal Information

THERMAL METRIC D (SOIC) N (PDIP) UNIT
16 PINS 16 PINS
RθJA Junction-to-ambient thermal resistance(1) 117.2 89.1 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 77.2 46.9 °C/W
RθJB Junction-to-board thermal resistance 75.6 47.4 °C/W
ψJT Junction-to-top characterization parameter 38.1 11.8 °C/W
ψJB Junction-to-board characterization parameter 75.3 47 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.