SCLS309E January   1996  – March 2022 SN54HC367 , SN74HC367

PRODUCTION DATA  

  1. 1 Features
  2. 2 Description
  3. 3 Revision History
  4. 4 Pin Configuration and Functions
  5. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 Recommended Operating Conditions (1)
    3. 5.3 Thermal Information
    4. 5.4 Electrical Characteristics
    5. 5.5 Switching Characteristics
    6. 5.6 Operating Characteristics
  6. 6 Parameter Measurement Information
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Device Functional Modes
  8. 8 Power Supply Recommendations
  9. 9 Layout
    1. 9.1 Layout Guidelines
  10. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • J|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.2 Recommended Operating Conditions(1)

SN54HC367SN74HC367UNIT
MINNOMMAXMINNOMMAX
VCCSupply voltage256256V
VIHHigh-level input voltageVCC = 2 V1.51.5V
VCC = 4.5 V3.153.15
VCC = 6 V4.24.2
VILLow-level input voltageVCC = 2 V0.50.5V
VCC = 4.5 V1.351.35
VCC = 6 V1.81.8
VIInput voltage0VCC0VCCV
VOOutput voltage0VCC0VCCV
ttInput transition rise/fall timeVCC = 2 V10001000ns
VCC = 4.5 V500500
VCC = 6 V400400
TAOperating free-air temperature-55125-4085°C
(1) All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report Implications of Slow or Floating SMOS Inputs, literature number SCBA004.