SCLS169G december   1982  – october 2022 SN54HCT74 , SN74HCT74

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Description
  4. 3 Revision History
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 Recommended Operating Conditions
    3. 5.3 Thermal Information
    4. 5.4 Electrical Characteristics
    5. 5.5 Timing Requirements
    6. 5.6 Switching Characteristics
    7. 5.7 Operating Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Power Supply Recommendations
    2. 8.2 Layout
      1. 8.2.1 Layout Guidelines
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • J|14
  • FK|20
  • W|14
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.3 Thermal Information

THERMAL METRIC D (SOIC) DB (SSOP) N (PDIP) NS (SO) PW (TSSOP) UNIT
14 PINS 14 PINS 14 PINS 14 PINS 14 PINS
RθJA Junction-to-ambient thermal resistance(1) 138.7 109.8 61.1 88.4 114.7 °C/W
RθJC (top) Junction-to-case (top) thermal resistance 93.8 54.7 48.9 46 44.3 °C/W
RθJB Junction-to-board thermal resistance 94.7 58.6 40.9 48.9 57.6 °C/W
ΨJT Junction-to-top characterization parameter 49.1 15.5 28.5 13.8 4.8 °C/W
ΨJB Junction-to-board characterization parameter 94.3 58 40.6 48.4 57 °C/W
RθJC (bot) Junction-to-case (bottom) thermal resistance N/A N/A N/A N/A N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.