SDLS025D December   1983  – May 2017 SN5400 , SN54LS00 , SN54S00 , SN7400 , SN74LS00 , SN74S00

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings: SN74LS00
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics: SNx400
    6. 6.6  Electrical Characteristics: SNx4LS00
    7. 6.7  Electrical Characteristics: SNx4S00
    8. 6.8  Switching Characteristics: SNx400
    9. 6.9  Switching Characteristics: SNx4LS00
    10. 6.10 Switching Characteristics: SNx4S00
    11. 6.11 Typical Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1 Propagation Delays, Setup and Hold Times, and Pulse Width
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Related Links
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Community Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • J|14
  • W|14
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9 Application and Implementation

NOTE

Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality.

9.1 Application Information

The SNx4xx00 devices are quadruple, 2-input NAND gate. A typical application of NAND gate can be as an error indicator as shown in Figure 3. If either of the sensor has an error, the error flag is high to indicate system error.

9.2 Typical Application

SN5400 SN54LS00 SN54S00 SN7400 SN74LS00 SN74S00 nand_app.gif Figure 3. Typical Application Diagram

9.2.1 Design Requirements

These devices use BJT technology and have unbalanced output drive with IOL and IOH specified as per the Recommended Operating Conditions.

9.2.2 Detailed Design Procedure

  • Recommended Input Conditions:
    • The inputs are TTL compliant.
    • Because the base-emitter junction at the inputs breaks down, no voltage greater than 5.5 V must be applied to the inputs.
    • Specified high and low levels: See VIH and VIL in Recommended Operating Conditions.
  • Recommended Output Conditions:

9.2.3 Application Curve

CL = 15 pF
SN5400 SN54LS00 SN54S00 SN7400 SN74LS00 SN74S00 D001_sdls025.gif Figure 4. TPLH (Across Devices)