SDLS020F May   1990  – July 2016 SN54LS06 , SN74LS06

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Examples
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Related Links
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Community Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Supply voltage, VCC 7 V
Input voltage, VI(2) 7 V
Output voltage, VO (SNx4LS06)(2)(3) 30 V
Absolute maximum junction temperature, TJ 150 °C
Storage temperature, Tstg –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to GND.
(3) This is the maximum voltage that must be applied to any output when it is in the off state.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±500 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±2000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Tested on N package

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)(1)
MIN NOM MAX UNIT
VCC Supply voltage 4.5 5 5.5 V
VIH High-level input voltage 2 V
VIL Low-level input voltage 0.8 V
VOH High-level output voltage (SNx4LS06) 30 V
IOL Low-level output current SN54LS06 30 mA
SN74LS06 40
TA Operating free-air temperature SN54LS06 –55 125 °C
SN74LS06 0 70
(1) All unused inputs of the device must be held at VCC or GND to ensure proper device operation. See the Implications of Slow or Floating CMOS Inputs application report.

6.4 Thermal Information

THERMAL METRIC(1) SN74LS06 UNIT
D (SOIC) DB (SSOP) N (PDIP) NS (SOP)
14 PINS 14 PINS 14 PINS 14 PINS
RθJA Junction-to-ambient thermal resistance 85.8 97.4 50.2 82.8 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 44 49.8 37.5 40.9 °C/W
RθJB Junction-to-board thermal resistance 40.3 44.5 30 41.4 °C/W
ψJT Junction-to-top characterization parameter 11.1 16.5 22.3 12.4 °C/W
ψJB Junction-to-board characterization parameter 40.1 44 29.9 41.1 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance — — — — °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

6.5 Electrical Characteristics

over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS(1) MIN TYP(2) MAX UNIT
VIK VCC = MIN, II = –12 mA –1.5 V
IOH VCC = MIN, VIL = 0.8 V, VOH = 30 V, SNx4LS06 0.25 mA
VOL VCC = MIN, VIH = 2 V IOL = 16 mA 0.25 0.4 V
IOL = 30 mA 0.7
IOL = 40 mA, SN74LS06 0.7
II VCC = MAX, VI = 7 V 1 mA
IIH VCC = MAX, VI = 2.4 V 20 µA
IIL VCC = MAX, VI = 0.4 V –0.2 mA
ICCH VCC= MAX 18 mA
ICCL VCC= MAX 60 mA
(1) For conditions shown as MIN or MAX, use the appropriate value specified under Recommended Operating Conditions.
(2) All typical values are at VCC = 5 V, and TA = 25°C.

6.6 Switching Characteristics

VCC = 5 V and TA = 25°C (see Figure 2)
PARAMETER TEST CONDITlONS MIN TYP MAX UNIT
tPLH From A (input) to Y (output), RL= 110 Ω, CL = 15 pF 7 15 ns
tPHL From A (input) to Y (output), RL= 110 Ω, CL = 15 pF 10 20

6.7 Typical Characteristics

SN54LS06 SN74LS06 D002_sdls020.gif Figure 1. Propagation Delay vs Temperature