SCAS287V January   1993  – May 2024 SN54LVC74A , SN74LVC74A

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information: SN74LVC74A
    5. 5.5  Electrical Characteristics
    6. 5.6  Timing Requirements: SN54LVC74A
    7. 5.7  Timing Requirements: SN74LVC74A
    8. 5.8  Timing Requirements: SN74LVC74A, –40°C to 125°C and –40°C to 85°C
    9. 5.9  Switching Characteristics: SN54LVC74A
    10. 5.10 Switching Characteristics: SN74LVC74A
    11. 5.11 Switching Characteristics: SN74LVC74A, –40°C to 125°C and –40°C to 85°C
    12. 5.12 Operating Characteristics
    13. 5.13 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • J|14
  • FK|20
  • W|14
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10 Revision History

Changes from Revision U (January 2017) to Revision V (May 2024)

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Added BQA package to Device Information table, Pin Configuration and Functions section, and Thermal Information tableGo
  • Added package size to Device Information tableGo

Changes from Revision T (July 2013) to Revision U (January 2017)

  • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go
  • Changed Package thermal impedance, RθJA, values in Thermal Information: SN74LVC74A From: 86 To: 93.7 (D), From: 96 To: 107.3 (DB), From: 76 To: 90.3 (NS), From: 113 To: 121.7 (PW), and From: 47 To: 54.9 (RGY)Go