SCAS287V January   1993  – May 2024 SN54LVC74A , SN74LVC74A

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information: SN74LVC74A
    5. 5.5  Electrical Characteristics
    6. 5.6  Timing Requirements: SN54LVC74A
    7. 5.7  Timing Requirements: SN74LVC74A
    8. 5.8  Timing Requirements: SN74LVC74A, –40°C to 125°C and –40°C to 85°C
    9. 5.9  Switching Characteristics: SN54LVC74A
    10. 5.10 Switching Characteristics: SN74LVC74A
    11. 5.11 Switching Characteristics: SN74LVC74A, –40°C to 125°C and –40°C to 85°C
    12. 5.12 Operating Characteristics
    13. 5.13 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • J|14
  • FK|20
  • W|14
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.4 Thermal Information: SN74LVC74A

THERMAL METRIC(1) SN74LVC74A UNIT
BQA (WQFN) D
(SOIC)		 DB
(SSOP)		 NS
(SO)		 PW
(TSSOP)		 RGY
(VQFN)
14 PINS 14 PINS 14 PINS 14 PINS 14 PINS 14 PINS
RθJA Junction-to-ambient thermal resistance 102.3 93.7 107.3 90.3 121.7 54.9 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 96.8 54.8 59.2 48.1 50.3 52.2 °C/W
RθJB Junction-to-board thermal resistance 70.9 48 54.6 49.1 63.4 30.8 °C/W
ψJT Junction-to-top characterization parameter 16.6 20.3 24.1 17.9 6.2 2.4 °C/W
ψJB Junction-to-board characterization parameter 70.9 47.7 54.1 48.8 62.8 30.9 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 50.1 — — — — 12.5 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.