SDLS025D December   1983  – May 2017 SN5400 , SN54LS00 , SN54S00 , SN7400 , SN74LS00 , SN74S00

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings: SN74LS00
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics: SNx400
    6. 6.6  Electrical Characteristics: SNx4LS00
    7. 6.7  Electrical Characteristics: SNx4S00
    8. 6.8  Switching Characteristics: SNx400
    9. 6.9  Switching Characteristics: SNx4LS00
    10. 6.10 Switching Characteristics: SNx4S00
    11. 6.11 Typical Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1 Propagation Delays, Setup and Hold Times, and Pulse Width
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Related Links
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Community Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • J|14
  • FK|20
  • W|14
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from C Revision (November 2016) to D Revision

  • Changed Typical Application Diagram see Application and Implementation section.Go

Changes from B Revision (October 2003) to C Revision

  • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section.Go
  • Changed Ordering Information table to Device Comparison Table; see Package Option Addendum at the end of the data sheetGo
  • Changed Package thermal impedance, RθJA, values in Thermal Information table From: 86°C/W To: 90.9°C/W (D), From: 96°C/W To: 102.8°C/W (DB), From: 80°C/W To: 54.8°C/W (N), and From: 76°C/W To: 89.7°C/W (NS)Go