SCAS991 April   2024 SN54SC8T541-SEP

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 SCxT Enhanced Input Voltage
        1. 7.3.1.1 Down Translation
        2. 7.3.1.2 Up Translation
      2. 7.3.2 Balanced CMOS 3-State Outputs
      3. 7.3.3 Clamp Diode Structure
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Power Considerations
        2. 8.2.1.2 Input Considerations
        3. 8.2.1.3 Output Considerations
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Tape and Reel Information
    2. 11.2 Mechanical Data

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • PW|20
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.5 Electrical Characteristics

over operating free-air temperature range; typical ratings measured at TA = 25°C (unless otherwise noted).
PARAMETER TEST CONDITIONS VCC MIN TYP MAX UNIT
VOH IOH = -50μA 1.2V to 5.5V VCC-0.2 V
IOH = -1mA 1.2V 0.8
IOH = -2mA 1.65V to 2V 1.21 1.7(1)
IOH = -3mA 2.25V to 2.75V 1.93 2.4(1)
IOH = -5.5mA 3V to 3.6V 2.49 3.08(1)
IOH = -8mA 4.5V to 5.5V 3.95 4.65(1)
IOH= –24mA 4.5V to 5.5V 3.15
VOL IOL= 50 μA 1.2V to 5.5V 0.1 V
IOL = 1mA 1.2V 0.2
IOL = 2mA 1.65V to 2V 0.1(1) 0.25
IOL = 3mA 2.25V to 2.75V 0.1(1) 0.2
IOL = 5.5mA 3V to 3.6V 0.2(1) 0.25
IOL= 8mA 4.5V to 5.5V 0.3(1) 0.35
IOL= 24mA 4.5V to 5.5V 0.75
II VI = 0V or VCC 0V to 5.5V ±0.1 ±1 µA
IOZ VO = VCC or GND and VCC = 5.5V 5.5V ±2.5 µA
ICC VI = VCC or GND, IO = 0 1.2V to 5.5V 2 93 µA
ΔICC One input at 0.3V or 3.4V, other inputs at 0 or VCC, IO = 0 5.5V 1.35 1.5 mA
One input at 0.3V or 1.1V, other inputs at 0 or VCC, IO = 0 1.8V 68 µA
CPD(2)(3) CL = 50 pF, F = 10MHz 1.2V to 5.5V 170 pF
(1) Typical value at nearest nominal voltage (1.8V, 2.5V, 3.3V, and 5V)
(2) CPD is used to determine the dynamic power consumption, per channel.
(3) PD= VCC2xFIx(CPD+ CL) where FI= input frequency, CL= output load capacitance, VCC= supply voltage.