SLLS545G November   2002  – October 2015 SN55HVD251 , SN65HVD251

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Supply Current
    6. 6.6  Electrical Characteristics: Driver
    7. 6.7  Electrical Characteristics: Receiver
    8. 6.8  VREF-Pin Characteristics
    9. 6.9  Power Dissipation Characteristics
    10. 6.10 Switching Characteristics: Driver
    11. 6.11 Switching Characteristics: Device
    12. 6.12 Switching Characteristics: Receiver
    13. 6.13 Dissipation Ratings
    14. 6.14 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Mode Control
      2. 8.3.2 High-Speed Mode
      3. 8.3.3 Slope Control Mode
      4. 8.3.4 Low-Power Mode
      5. 8.3.5 Thermal Shutdown
    4. 8.4 Device Functional Modes
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 Bus Loading, Length, and Number of Nodes
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 CAN Termination
        2. 9.2.2.2 Loop Propagation Delay
      3. 9.2.3 Application Curve
    3. 9.3 System Example
      1. 9.3.1 ISO 11898 Compliance of HVD251 5-V CAN Bus Transceiver
        1. 9.3.1.1 Introduction
        2. 9.3.1.2 Differential Signal
        3. 9.3.1.3 Common-Mode Signal
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Related Links
    2. 12.2 Community Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

13 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.