SLLS295B April   1998  – January 2023 SN65ALS1176

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Recommended Operating Conditions
    3. 6.3 Thermal Information
    4. 6.4 Electrical Characteristics - Driver
    5. 6.5 Switching Characteristics - Driver
    6. 6.6 Symbol Equivalents
    7. 6.7 Electrical Characteristics - Receiver
    8. 6.8 Switching Characteristics - Receiver
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Functional Block Diagram
    2. 8.2 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Typical Application
  10. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.3 Thermal Information

THERMAL METRIC(1)D (SOIC)UNIT
8-Pins
R θJAJunction-to-ambient thermal resistance116.7°C/W
R θJC(top)Junction-to-case thermal resistance56.3°C/W
R θJBJunction-to-board thermal resistance63.4°C/W
ψ JTJunction-to-top characterization parameter8.8°C/W
ψ JBJunction-to-board characterization parameter62.6°C/W
R θJC(bot)Junction-to-case (bottom) thermal resistanceN/A°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.