SLLS351F April   2002  – July 2021 SN65C3221 , SN75C3221

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions (1)
      1. 6.3.1 Thermal Information
    4. 6.4  Electrical Characteristics
    5. 6.5  Electrical Characteristics - Driver
    6. 6.6  Switching Characteristics - Driver
    7. 6.7  Electrical Characteristics - Receiver
    8. 6.8  Switching Characteristics - Receiver
    9. 6.9  Electrical Characteristics - Auto-Powerdown
    10. 6.10 Switching Characteristics - Auto-Powerdown
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
  10. 10Device and Documentation Support
    1. 10.1 Receiving Notification of Documentation Updates
    2. 10.2 Support Resources
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DB|16
  • PW|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.3.1 Thermal Information

THERMAL METRIC1

SN65C3221

SN75C3221

 UNIT

DB (SSOP)

PW (TSSOP)

 DB (SSOP) PW (TSSOP)

16 PINS

16 PINS

16 PINS

16 PINS
R θJA Junction-to-ambient thermal resistance

82.0

110.9

105.8

108.0

 °C/W
R θJC(top) Junction-to-case (top) thermal resistance

45.7

 41.7 51.9

41.1

 °C/W
R θJB Junction-to-board thermal resistance

44.4

57.2

57.6

51.4

 °C/W
ψ JT Junction-to-top characterization parameter

11.0

4.2

14.1

3.9

 °C/W
ψ JB Junction-to-board characterization parameter

43.8

56.6

56.8

50.9

 °C/W