SLLS697B December   2005  – June 2021 SN65C3232E , SN75C3232E

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Protection
    3. 6.3  ESD Protection, Driver
    4. 6.4  ESD Protection, Receiver
    5. 6.5  Recommended Operating Conditions
    6. 6.6  Thermal Information, SN65C3232E
    7. 6.7  Thermal Information, SN75C3232E
    8. 6.8  Electrical Characteristics, Power
    9. 6.9  Electrical Characteristics, Driver
    10. 6.10 Electrical Characteristics, Receiver
    11. 6.11 Switching Characteristics, Driver
    12. 6.12 Switching Characteristics, Receiver
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
      1. 8.1.1 Functional Block Diagram
      2. 8.1.2 Feature Description
        1. 8.1.2.1 Power
        2. 8.1.2.2 RS232 Driver
        3. 8.1.2.3 RS232 Receiver
      3. 8.1.3 Device Functional Modes
        1. 8.1.3.1 VCC Powered by 3 V to 5.5 V
        2. 8.1.3.2 VCC Unpowered, VCC = 0 V
  9. 9 Application and Implenentation
    1. 9.1 Application Information
    2.     Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Performance Plots
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Support Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from Revision A (December 2007) to Revision B (June 2021)

  • Added Device Information table, Pin Configuration and Functions section, Thermal Information tables, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go
  • Updated the list of Applications Go
  • Added a note specifying a minimum capacitor of 1 µF between VCC and GND to satisfy IEC ESD specifications in the ESD Protection, Driver tableGo
  • Added a note specifying the need for a 1-µF capacitor between VCC and GND to satisfy IEC ESD specifications in the ESD Protection, Receiver table.Go
  • Changed thermal parameters values for D and DB packages for SN65C3232E in Thermal Information, SN65C3232E table. Added additional thermal information for all packages.Go
  • Added Thermal Information, SN75C3232E table. Go