SLLS697B December   2005  – June 2021 SN65C3232E , SN75C3232E

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Protection
    3. 6.3  ESD Protection, Driver
    4. 6.4  ESD Protection, Receiver
    5. 6.5  Recommended Operating Conditions
    6. 6.6  Thermal Information, SN65C3232E
    7. 6.7  Thermal Information, SN75C3232E
    8. 6.8  Electrical Characteristics, Power
    9. 6.9  Electrical Characteristics, Driver
    10. 6.10 Electrical Characteristics, Receiver
    11. 6.11 Switching Characteristics, Driver
    12. 6.12 Switching Characteristics, Receiver
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
      1. 8.1.1 Functional Block Diagram
      2. 8.1.2 Feature Description
        1. 8.1.2.1 Power
        2. 8.1.2.2 RS232 Driver
        3. 8.1.2.3 RS232 Receiver
      3. 8.1.3 Device Functional Modes
        1. 8.1.3.1 VCC Powered by 3 V to 5.5 V
        2. 8.1.3.2 VCC Unpowered, VCC = 0 V
  9. 9 Application and Implenentation
    1. 9.1 Application Information
    2.     Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Performance Plots
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Support Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.7 Thermal Information, SN75C3232E

THERMAL METRIC(1) SN75C3232E UNIT
PW (TSSOP) D (SOIC) DW (SOIC) DB (SSOP)
16 PINS 16 PINS 16 PINS 16 PINS
R θJA Junction-to-ambient thermal resistance 108.0 82.0 57.0 46.0 °C/W
R θJC(top)

Junction-to-case (top) thermal resistance

 39.0 36.7 33.5 36.2 °C/W
R θJB Junction-to-board thermal resistance 54.4 33.6 37.1 43.8 °C/W
ψ JT Junction-to-top characterization parameter 3.3 4.2 7.5 4.2 °C/W
ψ JB Junction-to-board characterization parameter

53.8

33.3

37.1

42.9

 °C/W
R θJC(bot) Junction-to-case (bottom) thermal resistance

N/A

N/A

N/A

N/A

 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.