SLLS353I June   1999  – October 2022 SN65C3243 , SN75C3243

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Electrical Characteristics, Driver Section
    7. 6.7  Electrical Characteristics, Receiver Section
    8. 6.8  Electrical Characteristics, Auto-Powerdown Section
    9. 6.9  Switching Characteristics: Driver
    10. 6.10 Switching Characteristics: Receiver
    11. 6.11 Switching Characteristics: Auto-Powerdown
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Device Functional Modes
      1. 8.2.1 Function Tables
  9. 9 Device and Documentation Support
    1. 9.1 Device Support
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  10. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) DB (SSOP) DW (SOIC) PW (TSSOP) UNIT
28 PINS 28 PINS 28 PINS
RθJA Junction-to-ambient thermal resistance 76.1 59.0 70.3 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 35.8 28.8 21.0 °C/W
RθJB Junction-to-board thermal resistance 37.4 30.3 29.2 °C/W
ψJT Junction-to-top characterization parameter 7.4 7.8 1.3 °C/W
ψJB Junction-to-board characterization parameter 37.0 30.0 28.8 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.