SLLSEJ2G
July 2015 – March 2020
SN65DP159
,
SN75DP159
PRODUCTION DATA.
1
Features
2
Applications
3
Description
Device Images
DP159 Mother Board Application Structure
DP159 Dongle Application Structure
4
Revision History
5
Description (continued)
6
Pin Configuration and Functions
Pin Functions
7
Specifications
7.1
Absolute Maximum Ratings
7.2
ESD Ratings
7.3
Recommended Operating Conditions
7.4
Thermal Information
7.5
Power Supply Electrical Characteristics
7.6
Differential Input Electrical Characteristics
7.7
HDMI and DVI TMDS Output Electrical Characteristics
7.8
AUX, DDC, and I2C Electrical Characteristics
7.9
HPD Electrical Characteristics
7.10
HDMI and DVI Main Link Switching Characteristics
7.11
AUX Switching Characteristics (Only for RGZ Package)
7.12
HPD Switching Characteristics
7.13
DDC and I2C Switching Characteristics
7.14
Typical Characteristics
8
Parameter Measurement Information
9
Detailed Description
9.1
Overview
9.2
Functional Block Diagram
9.3
Feature Description
9.3.1
Reset Implementation
9.3.2
Operation Timing
9.3.3
I2C-over-AUX to DDC Bridge (SNx5DP159 48-Pin Package Version Only)
9.3.4
Input Lane Swap and Polarity Working
9.3.5
Main Link Inputs
9.3.6
Main Link Inputs Debug Tools
9.3.7
Receiver Equalizer
9.3.8
Termination Impedance Control
9.3.9
TMDS Outputs
9.3.9.1
Pre-Emphasis/De-Emphasis
9.4
Device Functional Modes
9.4.1
Retimer Mode
9.4.2
Redriver Mode
9.4.3
DDC Training for HDMI2.0 Data Rate Monitor
9.4.4
DDC Functional Description
9.5
Register Maps
9.5.1
DP-HDMI Adaptor ID Buffer
9.5.2
Local I2C Interface Overview
9.5.3
I2C Control Behavior
9.5.4
I2C Control and Status Registers
9.5.4.1
Bit Access Tag Conventions
9.5.4.2
CSR Bit Field Definitions
9.5.4.2.1
ID Registers
9.5.4.2.2
Misc Control
9.5.4.2.3
HDMI Control
9.5.4.2.4
Equalization Control Register
9.5.4.2.5
EyeScan Control Register
10
Application and Implementation
10.1
Application Information
10.1.1
Use Case of SNx5DP159
10.1.2
DDC Pullup Resistors
10.2
Typical Application
10.2.1
Design Requirements
10.2.2
Detailed Design Procedure
10.2.3
Application Curve
10.3
System Example
10.3.1
Compliance Testing
11
Power Supply Recommendations
11.1
Power Management
12
Layout
12.1
Layout Guidelines
12.2
Layout Examples
12.3
Thermal Considerations
13
Device and Documentation Support
13.1
Related Links
13.2
Documentation Support
13.2.1
Related Documentation
13.3
Receiving Notification of Documentation Updates
13.4
Community Resources
13.5
Trademarks
13.6
Electrostatic Discharge Caution
13.7
Glossary
14
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
RSB|40
MPQF185C
RGZ|48
MPQF123F
Thermal pad, mechanical data (Package|Pins)
RSB|40
QFND255H
RGZ|48
QFND014T
Orderable Information
sllsej2g_oa
sllsej2g_pm
10.2
Typical Application
Figure 33.
Implementation for Motherboard
1
Schematic