SLLSEO9D March   2016  – October 2024 SN65DPHY440SS , SN75DPHY440SS

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics, Power Supply
    6. 5.6 Electrical Characteristics
    7. 5.7 Timing Requirements
    8. 5.8 Switching Characteristics
    9. 5.9 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 HS Receive Equalization
      2. 6.3.2 HS TX Edge Rate Control
      3. 6.3.3 TX Voltage Swing and Pre-Emphasis Control
      4. 6.3.4 Dynamic De-skew
    4. 6.4 Device Functional Modes
      1. 6.4.1 Shutdown Mode
      2. 6.4.2 LP Mode
      3. 6.4.3 ULPS Mode
      4. 6.4.4 HS Mode
    5. 6.5 Register Maps
      1. 6.5.1  BIT Access Tag Conventions
      2. 6.5.2  Standard CSR Registers (address = 0x000 - 0x07)
      3. 6.5.3  Standard CSR Register (address = 0x08)
      4. 6.5.4  Standard CSR Register (address = 0x09)
      5. 6.5.5  Standard CSR Register (address = 0x0A)
      6. 6.5.6  Standard CSR Register (address = 0x0B)
      7. 6.5.7  Standard CSR Register (address = 0x0D)
      8. 6.5.8  Standard CSR Register (address = 0x0E)
      9. 6.5.9  Standard CSR Register (address = 0x10) [reset = 0xFF]
      10. 6.5.10 Standard CSR Register (address = 0x11) [reset = 0xFF]
  8. 7 Application and Implementation
    1. 7.1 Application Information,
    2. 7.2 Typical Application, CSI-2 Implementations
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Reset Implementation
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.4 Thermal Information

THERMAL METRIC (1)SNx5DPHY440SSUNIT
RHR (WQFN)
12 PINS
RθJAJunction-to-ambient thermal resistance42.1°C/W
RθJC(top)Junction-to-case (top) thermal resistance32.3°C/W
RθJBJunction-to-board thermal resistance12.8°C/W
ψJTJunction-to-top characterization parameter0.5°C/W
ψJBJunction-to-board characterization parameter12.6°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistance5.2°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.