SLLSEO9D March   2016  – October 2024 SN65DPHY440SS , SN75DPHY440SS

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics, Power Supply
    6. 5.6 Electrical Characteristics
    7. 5.7 Timing Requirements
    8. 5.8 Switching Characteristics
    9. 5.9 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 HS Receive Equalization
      2. 6.3.2 HS TX Edge Rate Control
      3. 6.3.3 TX Voltage Swing and Pre-Emphasis Control
      4. 6.3.4 Dynamic De-skew
    4. 6.4 Device Functional Modes
      1. 6.4.1 Shutdown Mode
      2. 6.4.2 LP Mode
      3. 6.4.3 ULPS Mode
      4. 6.4.4 HS Mode
    5. 6.5 Register Maps
      1. 6.5.1  BIT Access Tag Conventions
      2. 6.5.2  Standard CSR Registers (address = 0x000 - 0x07)
      3. 6.5.3  Standard CSR Register (address = 0x08)
      4. 6.5.4  Standard CSR Register (address = 0x09)
      5. 6.5.5  Standard CSR Register (address = 0x0A)
      6. 6.5.6  Standard CSR Register (address = 0x0B)
      7. 6.5.7  Standard CSR Register (address = 0x0D)
      8. 6.5.8  Standard CSR Register (address = 0x0E)
      9. 6.5.9  Standard CSR Register (address = 0x10) [reset = 0xFF]
      10. 6.5.10 Standard CSR Register (address = 0x11) [reset = 0xFF]
  8. 7 Application and Implementation
    1. 7.1 Application Information,
    2. 7.2 Typical Application, CSI-2 Implementations
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Reset Implementation
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.4.1 Layout Guidelines

  • DAxP/N and DB*P/N pairs should be routed with controlled 100-Ω differential impedance (± 15%) or 50-Ω single-ended impedance (± 15%).
  • Keep away from other high speed signals.
  • Keep lengths to within 5 mils of each other.
  • Length matching should be near the location of mismatch.
  • Each pair should be separated at least by 3 times the signal trace width.
  • The use of bends in differential traces should be kept to a minimum. When bends are used, the number of left and right bends should be as equal as possible and the angle of the bend should be ≥ 135 degrees. This will minimize any length mismatch causes by the bends and; therefore, minimize the impact bends have on EMI.
  • Route all differential pairs on the same of layer.
  • The number of VIAS should be kept to a minimum. It is recommended to keep the VIAS count to 2 or less.
  • Keep traces on layers adjacent to ground plane.
  • Do NOT route differential pairs over any plane split.
  • Adding Test points will cause impedance discontinuity and will; therefore, negatively impact signal performance. If test points are used, they should be placed in series and symmetrically. They must not be placed in a manner that causes a stub on the differential pair.