SLLS889C June   2008  – August 2016 SN65HVD1040A-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Power Dissipation Characteristics
    7. 7.7 Switching Characteristics
    8. 7.8 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Operating Modes
        1. 9.3.1.1 Bus States by Mode
        2. 9.3.1.2 Normal Mode
        3. 9.3.1.3 Standby Mode and RXD Wake-Up Request
      2. 9.3.2 Protection Features
        1. 9.3.2.1 TXD Dominant State Time-Out
        2. 9.3.2.2 Thermal Shutdown
        3. 9.3.2.3 Undervoltage Lockout and Unpowered Device
    4. 9.4 Device Functional Modes
  10. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Using With 3.3-V Microcontrollers
      2. 10.1.2 Using SPLIT With Split Termination
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
        1. 10.2.1.1 Bus Loading, Length, and Number of Nodes
        2. 10.2.1.2 CAN Termination
        3. 10.2.1.3 Loop Propagation Delay
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Transient Voltage Suppresser (TVS) Diodes
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
    3. 12.3 ESD Protection
  13. 13Device and Documentation Support
    1. 13.1 Receiving Notification of Documentation Updates
    2. 13.2 Community Resource
    3. 13.3 Trademarks
    4. 13.4 Electrostatic Discharge Caution
    5. 13.5 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from B Revision (September 2011) to C Revision

  • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go
  • Changed values in the Thermal Information table to align with JEDEC standards.Go

Changes from A Revision (January 2011) to B Revision

  • Changed the Driver Function Table foot note to include: Y = weak pull down to GNDGo

Changes from * Revision (June 2008) to A Revision

  • Changed VCC Supply voltage range From: –0.3 V to 7 V To: –0.3 V to 6 VGo
  • Changed VI Voltage input range (TXD, STB) From: -0.5 V to 6 V To: -0.3 V to 6 VGo