SLLS632C December   2005  – February 2015 SN65HVD1050

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (Continued)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Driver Electrical Characteristics
    6. 7.6  Receiver Electrical Characteristics
    7. 7.7  Device Switching Characteristics
    8. 7.8  Driver Switching Characteristics
    9. 7.9  Receiver Switching Characteristics
    10. 7.10 Supply Current
    11. 7.11 S-Pin Characteristics
    12. 7.12 VREF-Pin Characteristics
    13. 7.13 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Mode Control
        1. 9.3.1.1 Normal Mode
        2. 9.3.1.2 Silent Mode
      2. 9.3.2 TXD Dominant Timeout (DTO)
      3. 9.3.3 Thermal Shutdown
      4. 9.3.4 VREF
      5. 9.3.5 Operating Temperature Range
    4. 9.4 Device Functional Modes
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
        1. 10.2.1.1 Bus Loading, Length, and Number of Nodes
        2. 10.2.1.2 CAN Termination
          1. 10.2.1.2.1 Loop Propagation Delay
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 ESD Protection
        2. 10.2.2.2 Transient Voltage Suppresser (TVS) Diodes
      3. 10.2.3 Application Curve
    3. 10.3 System Example
      1. 10.3.1 ISO 11898 Compliance of SN65HVD1050 5-V CAN Transceiver
        1. 10.3.1.1 Introduction
        2. 10.3.1.2 Differential Signal
        3. 10.3.1.3 Common-Mode Signal
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Trademarks
    2. 13.2 Electrostatic Discharge Caution
    3. 13.3 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

13 Device and Documentation Support

13.1 Trademarks

DeviceNet is a trademark of Open DeviceNet Vendors Association, Inc.

All other trademarks are the property of their respective owners.

13.2 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

13.3 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.