SN65HVD11-HT 3.3-V RS-485 Transceiver
1 Features
- Operates With a 3.3-V Supply
- Bus-Pin ESD Protection Exceeds 16-kV Human-Body Model (HBM)
- 1/8 Unit-Load Option Available (up to 256 Nodes on Bus)
- Optional Driver Output Transition Times for Signaling Rates (1) of 1 Mbps, 10 Mbps, and
32 Mbps - Based on ANSI TIA/EIA-485-A
- Bus-Pin Short Circuit Protection From
–7 V to 12 V - Open-Circuit, Idle-Bus, and Shorted-Bus Fail-Safe Receiver
- Glitch-Free Power-Up and Power-Down Protection for Hot-Plugging Applications
- SN75176 Footprint
- Supports Extreme Temperature Applications:
- Controlled Baselines
- One Assembly and Test Sites
- One Fabrication Sites
- Available in Extreme (–55°C/210°C) Temperature Range (2)
- Extended Product Life Cycles
- Extended Product-Change Notifications
- Product Traceability
- Texas Instruments' High Temperature Products Use Highly Optimized Silicon (Die) Solutions With Design and Process Enhancements to Maximize Performance Over Extended Temperatures.
2 Applications
- Down-Hole Drilling
- High Temperature Environments
- Digital Motor Controls
- Utility Meters
- Chassis-to-Chassis Interconnects
- Electronic Security Stations
- Industrial Process Controls
- Building Automation
- Point-of-Sale (POS) Terminals and Networks
3 Description
The SN65HVD11-HT device combines a 3-state differential line driver and differential input line receiver that operates with a single 3.3-V power supply. It is designed for balanced transmission lines and meets or exceeds ANSI TIA/EIA-485-A and ISO 8482:1993, with the exception that the thermal shutdown is removed. This differential bus transceiver is a monolithic integrated circuit designed for bidirectional data communication on multipoint bus-transmission lines. The driver and receiver have active-high and active-low enables, respectively, that can be externally connected together to function as direction control.
The driver differential outputs and receiver differential inputs connect internally to form a differential input/ output (I/O) bus port that is designed to offer minimum loading to the bus when the driver is disabled or VCC = 0.
Device Information(1)
| PART NUMBER | PACKAGE | BODY SIZE (NOM) |
|---|---|---|
| SN65HVD11-HT | SOIC (8) | 4.90 mm × 3.91 mm |
| CFP (8) (2) | 6.90 mm × 5.65 mm | |
| CFP (8) (3) | 6.90 mm × 5.65 mm | |
| CDIP SB (8) | 11.81 mm × 7.49 mm |
- For all available packages, see the orderable addendum at the end of the data sheet.
- HKJ Package
- HKQ Package
Typical Application Diagram
4 Revision History
Changes from E Revision (June 2012) to F Revision
- Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go
5 Pin Configuration and Functions
Pin Functions
| PIN | TYPE | DESCRIPTION | ||
|---|---|---|---|---|
| NAME | SOIC, PDIP |
HKQ | ||
| A | 6 | 6 | Bus input/output | Driver output or receiver input (complementary to B) |
| B | 7 | 7 | Bus input/output | Driver output or receiver input (complementary to A) |
| D | 4 | 4 | Digital input | Driver data input |
| DE | 3 | 3 | Digital input | Active-high driver enable |
| GND | 5 | 5 | Reference potential | Local device ground |
| R | 1 | 1 | Digital output | Receive data output |
| RE | 2 | 2 | Digital input | Active-low receiver enable |
| VCC | 8 | 8 | Supply | 3-V to 3.6-V supply |
Bare Die Information
| DIE THICKNESS | BACKSIDE FINISH | BACKSIDE POTENTIAL | BOND PAD METALLIZATION COMPOSITION |
|---|---|---|---|
| 15 mils. | Silicon with backgrind | GND | Cu-Ni-Pd |
Bond Pad Coordinates in Microns - Rev A
| DESCRIPTION(1) | PAD NUMBER | a | b | c | d |
|---|---|---|---|---|---|
| R | 1 | 69.3 | 372.15 | 185.3 | 489.15 |
| ~RE | 2 | 388.75 | 71.5 | 503.75 | 186.5 |
| DNC | 3 | 722.4 | 55.4 | 839.4 | 172.4 |
| DNC | 4 | 891.4 | 55.4 | 1008.4 | 172.4 |
| DE | 5 | 1174.8 | 71.5 | 1289.8 | 186.5 |
| DNC | 6 | 1754.35 | 65.4 | 1869.35 | 180.4 |
| DNC | 7 | 1907.35 | 65.4 | 2022.35 | 180.4 |
| D | 8 | 2280.55 | 69.5 | 2395.55 | 184.5 |
| DNC | 9 | 2733.5 | 371.5 | 2848.5 | 486.5 |
| GND | 10 | 2691 | 1693.1 | 2808 | 1810.1 |
| GND | 11 | 2535 | 1693.1 | 2652 | 1810.1 |
| DNC | 12 | 2253.45 | 1685.65 | 2368.45 | 1800.65 |
| A | 13 | 1961.55 | 1693.1 | 2078.55 | 1810.1 |
| B | 14 | 799.55 | 1693.1 | 916.55 | 1810.1 |
| DNC | 15 | 498.35 | 1681.2 | 613.35 | 1796.2 |
| VCC | 16 | 244.8 | 1668.5 | 359.8 | 1783.5 |
| VCC | 17 | 91.8 | 1668.5 | 206.8 | 1783.5 |
