SLLS872J January   2008  – March 2023 SN65HVD1785 , SN65HVD1786 , SN65HVD1787 , SN65HVD1791 , SN65HVD1792 , SN65HVD1793

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Product Selection Guide
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings (1)
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Thermal Considerations
    7. 7.7 Switching Characteristics
    8. 7.8 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Hot-Plugging
      2. 9.3.2 Receiver Failsafe
      3. 9.3.3 70-V Fault-Protection
      4. 9.3.4 Additional Options
    4. 9.4 Device Functional Modes
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
        1. 10.2.1.1 Data Rate and Bus Length
        2. 10.2.1.2 Stub Length
        3. 10.2.1.3 Receiver Failsafe
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curve
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
    2. 13.2 Receiving Notification of Documentation Updates
    3. 13.3 Support Resources
    4. 13.4 Trademarks
    5. 13.5 Electrostatic Discharge Caution
    6. 13.6 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.4 Thermal Information

THERMAL METRIC(1)SN65HVD1785, SN65HVD1786,
SN65HVD1787		SN65HVD1791, SN65HVD1792,
SN65HVD1793		UNIT
D (SOIC)P (PDIP)D (SOIC)
8 PINS8 PINS14 PINS
RθJAJunction-to-ambient thermal resistance1385995°C/W
RθJA (low-K)Junction-to-case (top) thermal resistance242128168°C/W
RθJC(top)Junction-to-board thermal resistance616144°C/W
RθJBJunction-to-top characterization parameter623940°C/W
ψJTJunction-to-board characterization parameter3.417.68.2°C/W
ψJBJunction-to-case (bottom) thermal resistance33.428.325°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.