SLLSEA2D December   2011  – May 2015 SN65HVD255 , SN65HVD256 , SN65HVD257

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Options
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Power Dissipation
    7. 7.7 Switching Characteristics
    8. 7.8 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 TXD Dominant Timeout (DTO)
      2. 9.3.2 RXD Dominant Timeout (SN65HVD257)
      3. 9.3.3 Thermal Shutdown
      4. 9.3.4 Undervoltage Lockout
      5. 9.3.5 FAULT Pin (SN65HVD257)
      6. 9.3.6 Unpowered Device
      7. 9.3.7 Floating Pins
      8. 9.3.8 CAN Bus Short-Circuit Current Limiting
    4. 9.4 Device Functional Modes
      1. 9.4.1 Operating Modes
      2. 9.4.2 Can Bus States
      3. 9.4.3 Normal Mode
      4. 9.4.4 Silent Mode
      5. 9.4.5 Digital Inputs and Outputs
        1. 9.4.5.1 5-V VCC Only Devices (SN65HVD255 and SN65HVD257)
        2. 9.4.5.2 5-V VCC With VRXD RXD Output Supply Devices (SN65HVD256)
        3. 9.4.5.3 5-V VCC with FAULT Open-Drain Output Device (SN65HVD257)
  10. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Bus Loading, Length, and Number of Nodes
    2. 10.2 Typical Applications
      1. 10.2.1 Typical 5-V Microcontroller Application
        1. 10.2.1.1 Design Requirements
          1. 10.2.1.1.1 CAN Termination
        2. 10.2.1.2 Detailed Design Procedure
          1. 10.2.1.2.1 Example: Functional Safety Using the SN65HVD257 in a Redundant Physical Layer CAN Network Topology
        3. 10.2.1.3 Application Curves
      2. 10.2.2 Typical 3.3-V Microcontroller Application
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Related Links
    2. 13.2 Trademarks
    3. 13.3 Electrostatic Discharge Caution
    4. 13.4 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

13 Device and Documentation Support

13.1 Related Links

The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy.

Table 7. Related Links

PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY
SN65HVD255 Click here Click here Click here Click here Click here
SN65HVD256 Click here Click here Click here Click here Click here
SN65HVD257 Click here Click here Click here Click here Click here

13.2 Trademarks

All other trademarks are the property of their respective owners.

13.3 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

13.4 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.