SLLSEA2D December   2011  – May 2015 SN65HVD255 , SN65HVD256 , SN65HVD257

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Options
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Power Dissipation
    7. 7.7 Switching Characteristics
    8. 7.8 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 TXD Dominant Timeout (DTO)
      2. 9.3.2 RXD Dominant Timeout (SN65HVD257)
      3. 9.3.3 Thermal Shutdown
      4. 9.3.4 Undervoltage Lockout
      5. 9.3.5 FAULT Pin (SN65HVD257)
      6. 9.3.6 Unpowered Device
      7. 9.3.7 Floating Pins
      8. 9.3.8 CAN Bus Short-Circuit Current Limiting
    4. 9.4 Device Functional Modes
      1. 9.4.1 Operating Modes
      2. 9.4.2 Can Bus States
      3. 9.4.3 Normal Mode
      4. 9.4.4 Silent Mode
      5. 9.4.5 Digital Inputs and Outputs
        1. 9.4.5.1 5-V VCC Only Devices (SN65HVD255 and SN65HVD257)
        2. 9.4.5.2 5-V VCC With VRXD RXD Output Supply Devices (SN65HVD256)
        3. 9.4.5.3 5-V VCC with FAULT Open-Drain Output Device (SN65HVD257)
  10. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Bus Loading, Length, and Number of Nodes
    2. 10.2 Typical Applications
      1. 10.2.1 Typical 5-V Microcontroller Application
        1. 10.2.1.1 Design Requirements
          1. 10.2.1.1.1 CAN Termination
        2. 10.2.1.2 Detailed Design Procedure
          1. 10.2.1.2.1 Example: Functional Safety Using the SN65HVD257 in a Redundant Physical Layer CAN Network Topology
        3. 10.2.1.3 Application Curves
      2. 10.2.2 Typical 3.3-V Microcontroller Application
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Related Links
    2. 13.2 Trademarks
    3. 13.3 Electrostatic Discharge Caution
    4. 13.4 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

14 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.