SLLSEI3A September   2013  – November 2015 SN65HVD265 , SN65HVD266 , SN65HVD267

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configurations and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings: AEC
    3. 7.3 ESD Ratings: IEC
    4. 7.4 Transient Protection
    5. 7.5 Recommended Operating Conditions
    6. 7.6 Thermal Information
    7. 7.7 Electrical Characteristics
    8. 7.8 Switching Characteristics
    9. 7.9 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 TXD Dominant Timeout (DTO)
        1. 9.3.1.1 RXD Dominant Timeout (SN65HVD267)
        2. 9.3.1.2 Thermal Shutdown
        3. 9.3.1.3 Undervoltage Lockout
        4. 9.3.1.4 Fault Terminal (SN65HVD267)
        5. 9.3.1.5 Unpowered Device
        6. 9.3.1.6 Floating Terminals
        7. 9.3.1.7 CAN Bus Short Circuit Current Limiting
    4. 9.4 Device Functional Modes
      1. 9.4.1 Can Bus States
      2. 9.4.2 Normal Mode
      3. 9.4.3 Silent Mode
      4. 9.4.4 Driver and Receiver Function Tables
      5. 9.4.5 Digital Inputs and Outputs
        1. 9.4.5.1 5-V VCC Only Devices (SN65HVD265 and SN65HVD267)
        2. 9.4.5.2 5-V VCC with VRXD RXD Output Supply Devices (SN65HVD266)
        3. 9.4.5.3 5-V VCC with FAULT Open-Drain Output Device (SN65HVD267)
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
        1. 10.2.1.1 Bus Loading, Length and Number of Nodes
      2. 10.2.2 Detailed Design Procedures
        1. 10.2.2.1 CAN Termination
        2. 10.2.2.2 Functional Safety Using the SN65HVD267 in a Redundant Physical Layer CAN Network Topology
      3. 10.2.3 Application Curve
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Related Links
    2. 13.2 Community Resources
    3. 13.3 Trademarks
    4. 13.4 Electrostatic Discharge Caution
    5. 13.5 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

14 Mechanical, Packaging, and Orderable Information

The following pages include mechanical packaging and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.