SLLS771F November   2006  – March 2023 SN65HVD3080E , SN65HVD3083E , SN65HVD3086E

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  Power Dissipation Ratings
    3. 5.3  Electrostatic Discharge Protection
    4. 5.4  Supply Current
    5. 5.5  Recommended Operating Conditions
    6. 5.6  Thermal Information
    7. 5.7  Driver Electrical Characteristics
    8. 5.8  Driver Switching Characteristics
    9. 5.9  Receiver Electrical Characteristics
    10. 5.10 Receiver Switching Characteristics
    11. 5.11 Typical Characteristics
  6. 6 Parameter Measurement Information
  7. 7 Device Information
    1. 7.1 Function Tables
    2. 7.2 Equivalent Input and Output Schematic Diagrams
  8. 8 Application Information
    1. 8.1 Hot-Plugging
  9. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  10. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.2 Power Dissipation Ratings

PACKAGE TA < 25°C DERATING FACTOR(1)
ABOVE TA < 25°C		 TA = 85°C
10-pin MSOP (DGS) 463 mW 3.71 mW/°C 241 mW
14-pin SOIC (D) 765 mW 6.1 mW/°C 400 mW
(1) This is the inverse of the junction-to-ambient thermal resistance when board-mounted and with no air flow.