SLLS665M September   2005  – February 2023 SN65HVD30 , SN65HVD31 , SN65HVD32 , SN65HVD33 , SN65HVD34 , SN65HVD35

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison
    1.     6
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics: Driver
    6. 7.6  Electrical Characteristics: Receiver
    7. 7.7  Device Power Dissipation – PD
    8. 7.8  Supply Current Characteristics
    9. 7.9  Switching Characteristics: Driver
    10. 7.10 Switching Characteristics: Receiver
    11. 7.11 Dissipation Ratings
    12. 7.12 Typical Characteristics
      1.      Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Low-Power Standby Mode
      2. 8.3.2 Driver Output Current Limiting
      3. 8.3.3 Hot-Plugging
      4. 8.3.4 Receiver Failsafe
      5. 8.3.5 Safe Operation With Bus Contention
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 Data Rate and Bus Length
        2. 9.2.1.2 Stub Length
        3. 9.2.1.3 Bus Loading
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  10. 10Device and Documentation Support
    1. 10.1 Receiving Notification of Documentation Updates
    2. 10.2 Support Resources
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.3 Power Supply Recommendations

To ensure reliable operation at all data rates and supply voltages, each supply must be decoupled with a
100-nF ceramic capacitor located as close as possible to the supply pins. This helps to reduce supply voltage ripple present on the outputs of switched-mode power supplies and also helps compensate for the resistance and inductance of the PCB power planes.