SLLS666F September   2005  – March 2023 SN65HVD50 , SN65HVD51 , SN65HVD52 , SN65HVD53 , SN65HVD54 , SN65HVD55

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Available Options
  6. 6 Pin Configurations
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 Recommended Operating Conditions
    3. 7.3 Electrostatic Discharge Protection
    4. 7.4 Driver Electrical Characteristics
    5. 7.5 Driver Switching Characteristics
    6. 7.6 Receiver Electrical Characteristics
    7. 7.7 Receiver Switching Characteristics
    8. 7.8 Thermal Characteristics
    9. 7.9 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Device Information
    1. 9.1 Ll-Power Standby Mode
    2. 9.2 Function Tables
    3. 9.3 Equivalent Input and Output Schematic Diagrams
  10. 10Application and Implementation
    1. 10.1 Thermal Characteristics of IC Packages
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Support Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)(2)
UNIT
VCC Supply voltage range –0.3 V to 6 V
V(A), V(B), V(Y), V(Z) Voltage range at any bus terminal (A, B, Y, Z) –9 V to 14 V
V(TRANS) Voltage input, transient pulse through 100 Ω. See Figure 8-12 (A, B, Y, Z)(3) –50 to 50 V
VI Voltage input range (D, DE, RE) -0.5 V to 7 V
PD(cont) Continuous total power dissipation Internally limited(4)
IO Output current (receiver output only, R) 11 mA
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values, except differential I/O bus voltages, are with respect to network ground terminal.
(3) This tests survivability only and the output state of the receiver is not specified.
(4) The thermal shutdown typically occurs when the junction temperature reaches 165°C.