SLLSFI7 October   2020 SN65HVD64

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Coaxial Interface
      2. 8.3.2 Reference Input
      3. 8.3.3 RS-485 Direction Control
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Driver Amplitude Adjust
      2. 9.1.2 Direction Control
      3. 9.1.3 Direction Control Time Constant
      4. 9.1.4 Conversion Between dBm and Peak-to-Peak Voltage
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1)VQFNUNIT
RGT 16 Pins
RθJAJunction-to-ambient thermal resistance49.4°C/W
RθJCtopJunction-to-case (top) thermal resistance64.2°C/W
RθJBJunction-to-board thermal resistance22.9°C/W
ψJTJunction-to-top characterization parameter1.7°C/W
ψJBJunction-to-board characterization parameter22.9°C/W
RθJCbotJunction-to-case (bottom) thermal resistance25°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.