SLLS163F July   1993  – April 2024 SN65LBC172 , SN75LBC172

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 Recommended Operating Conditions
    3. 5.3 Dissipation Rating Table
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Thermal Characteristics of Ic Packages
    2. 7.2 Device Functional Modes
  9. 8 Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • N|16
  • DW|20
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.4 Thermal Information

THERMAL METRIC(1)N (PDIP)DW (SOIC)UNIT
16 PINS20 PINS
RθJAJunction-to-ambient thermal resistance60.666.8°C/W
RθJC(top)Junction-to-case (top) thermal resistance48.134.4°C/W
RθJBJunction-to-board thermal resistance40.639.7°C/W
ψJTJunction-to-top characterization parameter27.58.9°C/W
ψJBJunction-to-board characterization parameter40.339°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistancen/an/a°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.