SLLS456C November   2000  – November 2023 SN65LBC173A , SN75LBC173A

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Dissipation Rating Table
    4. 5.4 Thermal Information
    5. 5.5 Recommended Operating Conditions
    6. 5.6 Electrical Characteristics
    7. 5.7 Switching Characteristics
    8. 5.8 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Typical Application
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.3 Dissipation Rating Table

PACKAGE TA ≤ 25°C POWER RATING DERATING FACTOR(1) ABOVE TA = 25°C TA = 70°C POWER RATING TA = 85°C POWER RATING
D 1080 mW 8.7 mW/°C 690 mW 560 mW
N 1150 mW 9.2 mW/°C 736 mW 598 mW
(1) This is the inverse of the junction-to-ambient thermal resistance when board-mounted and with no air flow.