SLLS162F July   1993  – April 2024 SN65LBC174 , SN75LBC174

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 Recommended Operating Conditions
    3. 5.3 Dissipation Rating Table
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Thermal Characteristics of Ic Packages
    2. 7.2 Device Functional Modes
  9. 8 Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • N|16
  • DW|20
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.2 Device Functional Modes

Table 7-1 Functional Tables (Each Driver)
INPUT(1) ENABLE OUTPUTS
Y Z
H H H L
L H L H
X L Z Z
(1) H = high level, L = low level, X = irrelevant, Z = high impedance (off)
GUID-06EB673D-3925-4F2C-910E-AD98CB5BB577-low.png Figure 7-2 Schematic of Inputs and Outputs