SLLS732A October   2006  – November 2019 SN65LBC174A-EP

PRODUCTION DATA.  

  1. 1Features
  2. 2Applications
  3. 3Description
    1.     Device Images
      1.      Logic Diagram (Positive Logic)
  4. 4Revision History
  5. 5Description (continued)
    1. 5.1 Pin Configuration and Functions
      1.      Pin Functions
    2. 5.2 Specifications
      1. 5.2.1 Absolute Maximum Ratings
      2. 5.2.2 ESD Ratings
      3. 5.2.3 Recommended Operating Conditions
      4. 5.2.4 Thermal Information
      5. 5.2.5 Electrical Characteristics
      6. 5.2.6 Switching Characteristics
      7. 5.2.7 Typical Characteristics
    3. 5.3 Parameter Measurement Information
    4. 5.4 Detailed Description
      1. 5.4.1 Overview
      2. 5.4.2 Functional Block Diagram
      3. 5.4.3 Feature Description
      4. 5.4.4 Device Functional Modes
    5. 5.5 Application and Implementation
      1. 5.5.1 Application Information
      2. 5.5.2 Typical Application
        1. 5.5.2.1 Design Requirements
        2. 5.5.2.2 Detailed Design Procedure
        3. 5.5.2.3 Application Curve
    6. 5.6 Power Supply Recommendations
    7. 5.7 Layout
      1. 5.7.1 Layout Guidelines
      2. 5.7.2 Layout Example
  6. 6Device and Documentation Support
    1. 6.1 Receiving Notification of Documentation Updates
    2. 6.2 Support Resources
    3. 6.3 Trademarks
    4. 6.4 Electrostatic Discharge Caution
    5. 6.5 Glossary
  7. 7Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DW|16
  • DW|20
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.2.4 Thermal Information

THERMAL METRIC(1) SN65LBC174A-EP UNIT
DW (SOIC)
20 PINS 16 PINS
RθJA Junction-to-ambient thermal resistance 61.3 60.4 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 26.2 24.3 °C/W
RθJB Junction-to-board thermal resistance 29.3 26.1 °C/W
ψJT Junction-to-top characterization parameter 4.9 4.1 °C/W
ψJB Junction-to-board characterization parameter 28.8 25.6 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance n/a n/a °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.