SLLS446G October   2000  – April 2024 SN65LBC174A , SN75LBC174A

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 Dissipation Rating Table
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Typical Characteristics
  7. 6 Parameter Measure Information
  8. 7 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DW|16
  • N|16
  • DW|20
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.2 Dissipation Rating Table

Table 5-1 Dissipation Rating Table
PACKAGE(1) JEDEC BOARD MODEL TA ≤ 25°C
POWER RATING		 DERATING FACTOR (2)
ABOVE TA = 25°C		 TA = 70°C
POWER RATING		 TA = 85°C
POWER RATING
16 DW LOW K 1200 mW 9.6 mW/°C 769 mW 625 mW
HIGH K 2240 mW  17.9 mW/°C 1434 mW 1165 mW
20 DW LOW K 1483 mW 11.86 mW/°C 949 mW 771 mW
HIGH K 2753 mW 22 mW/°C 1762 mW 1432 mW
16 N LOW K 1150 mW 9.2 mW/°C 736 mW 598 mW
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com.
(2) This is the inverse of the junction-to-ambient thermal resistance when board-mounted and with no air flow.