SGLS211B October   2003  – January 2023 SN65LBC176-Q1

PRODUCTION DATA  

  1. 1Features
  2. 2Description
  3. 3Revision History
  4. 4Pin Configuration and Functions
  5. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 Recommended Operating Conditions
    3. 5.3 Thermal Resistance Characteristics
    4. 5.4 Electrical Characteristics - Driver
    5. 5.5 Switching Characteristics - Driver
      1. 5.5.1 Symbol Equivalents
    6. 5.6 Electrical Characteristics - Reciever
    7. 5.7 Switching Characteristics - Reciever
      1.      Parameter Measurement Information
  6. 6Detailed Description
    1. 6.1 Device Functional Modes
  7. 7Device and Documentation Support
    1. 7.1 Documentation Support
      1. 7.1.1 Related Documentation
    2. 7.2 Receiving Notification of Documentation Updates
    3. 7.3 Support Resources
    4. 7.4 Trademarks
    5. 7.5 Electrostatic Discharge Caution
    6. 7.6 Glossary
  8. 8Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.3 Thermal Resistance Characteristics

THERMAL METRIC(1)SN65LBC176-Q1UNIT
D (SOIC)
8 PINS
R θJAJunction-to-ambient thermal resistance

116.7

°C/W
R θJC

Junction-to-case thermal resistance

56.3

°C/W
R θJBJunction-to-board thermal resistance

63.4

°C/W
ψ JTJunction-to-top characterization parameter

8.8

°C/W
ψ JBJunction-to-board characterization parameter

62.6

°C/W
R θJC(bot)Junction-to-case (bottom) thermal resistancen/a°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.