SLLS174I February   1994  – October 2022 SN55LBC180 , SN65LBC180 , SN75LBC180

PRODUCTION DATA  

  1. 1 Features
  2. 2 Description
  3. 3 Description (Continued)
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Dissipation Rating Table
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information Table
    5. 6.5 Driver Section
      1. 6.5.1 Electrical Characteristics
      2. 6.5.2 Switching Characteristics
      3. 6.5.3 Switching Characteristics: SN55LBC180
    6. 6.6 Receiver Section
      1. 6.6.1 Electrical Characteristics
      2. 6.6.2 Switching Characteristics
      3. 6.6.3 Switching Characteristics: SN55LBC180
    7. 6.7 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Function Tables
    2. 8.2 Schematics of Inputs and Outputs
  9. 9 Application and Implementation
    1. 9.1 Application Information
  10. 10Device and Documentation Support
    1. 10.1 Receiving Notification of Documentation Updates
    2. 10.2 Support Resources
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|14
  • RSA|16
  • N|14
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information Table

THERMAL METRIC(1)D (SOIC)N (PDIP)RSA (QFN)UNIT
14 Pins14 Pins16 Pins
R θJAJunction-to-ambient thermal resistance93.253.438.7°C/W
R θJC(top)Junction-to-case (top) thermal resistance47.540.035.6°C/W
R θJBJunction-to-board thermal resistance49.433.217.5°C/W
ψ JTJunction-to-top characterization parameter11.219.01.1°C/W
ψ JBJunction-to-board characterization parameter48.932.917.5°C/W
R θJC(bot)Junction-to-case (bottom) thermal resistancen/an/a7.9°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.