SLLS575A AUGUST   2003  – July 2015 SN65LVDS049

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Device Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Dissipation Rating
    8. 6.8 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Driver Offset
      2. 8.3.2 Receiver Open Circuit Fail-Safe
      3. 8.3.3 Receiver Common-Mode Range
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Point-to-Point Communications
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1  Bypass Capacitance
          2. 9.2.1.2.2  Driver Supply Voltage
          3. 9.2.1.2.3  Driver Input Voltage
          4. 9.2.1.2.4  Driver Output Voltage
          5. 9.2.1.2.5  Interconnecting Media
          6. 9.2.1.2.6  PCB Transmission Lines
          7. 9.2.1.2.7  Termination Resistor
          8. 9.2.1.2.8  Receiver Supply Voltage
          9. 9.2.1.2.9  Receiver Input Common-Mode Range
          10. 9.2.1.2.10 Receiver Input Signal
          11. 9.2.1.2.11 Receiver Output Signal
        3. 9.2.1.3 Application Curve
      2. 9.2.2 Multidrop Communications
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
          1. 9.2.2.2.1 Interconnecting Media
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Microstrip vs. Stripline Topologies
      2. 11.1.2 Dielectric Type and Board Construction
      3. 11.1.3 Recommended Stack Layout
      4. 11.1.4 Separation Between Traces
      5. 11.1.5 Crosstalk and Ground Bounce Minimization
      6. 11.1.6 Decoupling
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Development Support
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • DS90LV049 Compatible
  • Up to 400-Mbps Signaling Rates
  • Flow-Through Pinout
  • 50-ps Driver Channel-to-Channel Skew (Typical)
  • 50-ps Receiver Channel-to-Channel Skew (Typical)
  • 3.3-V Power Supply
  • High-Impedance Disable for All Outputs
  • Internal Fail-safe Biasing of Receiver Inputs
  • 1.4-ns Driver Propagation Delay (Typical)
  • 1.9-ns Receiver Propagation Delay (Typical)
  • High-Impedance Bus Pins on Power Down
  • ANSI TIA/EIA-644-A Compliant
  • Receiver Input and Driver Output ESD Exceeds 10 kV
  • 16-Pin TSSOP Package

2 Applications

  • Full-Duplex LVDS Communications of Clock and Data
  • Printers

3 Description

The SN65LVDS049 device is a dual flow-through differential line driver-receiver pair that uses low-voltage differential signaling (LVDS) to achieve signaling rates as high as 400 Mbps. The driver and receiver electrical interfaces are compliant to the TIA/EIA-644-A standard.

The intended application of this device and signaling technique is for point-to-point baseband data transmission over controlled impedance media of approximately 100-Ω characteristic impedance. The transmission media may be printed-circuit board traces, backplanes, or cables. The ultimate rate and distance of data transfer is dependent upon the attenuation characteristics of the media, the noise coupling to the environment, and other application specific characteristics.

The SN65LVDS049 is characterized for operation from –40°C to 85°C

Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)
SN65LVDS049 TSSOP (16) 5.00 mm × 4.40 mm
  1. For all available packages, see the orderable addendum at the end of the data sheet.

Block Diagram

SN65LVDS049 fd_lls575.gif