SLLS301R APRIL   1998  – January 2016 SN65LVDS050 , SN65LVDS051 , SN65LVDS179 , SN65LVDS180

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (Continued)
  6. 6 Device Options
  7. 7 Pin Configuration and Functions
  8. 8 Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  Thermal Information
    5. 8.5  Device Electrical Characteristics
    6. 8.6  Driver Electrical Characteristics
    7. 8.7  Receiver Electrical Characteristics
    8. 8.8  Driver Switching Characteristics
    9. 8.9  Receiver Switching Characteristics
    10. 8.10 Typical Characteristics
  9. 9 Parameter Measurement Information
    1. 9.1 Driver
    2. 9.2 Receiver
  10. 10Detailed Description
    1. 10.1 Overview
    2. 10.2 Functional Block Diagram
    3. 10.3 Feature Description
      1. 10.3.1 Driver Offset
      2. 10.3.2 5-V Input Tolerance
      3. 10.3.3 NC Pins
      4. 10.3.4 Driver Equivalent Schematics
      5. 10.3.5 Receiver Features
        1. 10.3.5.1 Receiver Output States
        2. 10.3.5.2 Receiver Open-Circuit Fail-Safe
        3. 10.3.5.3 Receiver Power-On Reset
        4. 10.3.5.4 Common-Mode Range vs Supply Voltage
        5. 10.3.5.5 General Purpose Comparator
        6. 10.3.5.6 Receiver Equivalent Schematics
    4. 10.4 Device Functional Modes
      1. 10.4.1 Function Tables
  11. 11Application and Implementation
    1. 11.1 Application Information
    2. 11.2 Typical Application
      1. 11.2.1 Design Requirements
      2. 11.2.2 Detailed Design Procedure
        1. 11.2.2.1 Equipment
        2. 11.2.2.2 Driver Supply Voltage
        3. 11.2.2.3 Driver Bypass Capacitance
        4. 11.2.2.4 Driver Output Voltage
        5. 11.2.2.5 Interconnecting Media
        6. 11.2.2.6 PCB Transmission Lines
        7. 11.2.2.7 Termination Resistor
      3. 11.2.3 Application Curves
  12. 12Power Supply Recommendations
  13. 13Layout
    1. 13.1 Layout Guidelines
      1. 13.1.1 Microstrip vs. Stripline Topologies
      2. 13.1.2 Dielectric Type and Board Construction
      3. 13.1.3 Recommended Stack Layout
      4. 13.1.4 Separation Between Traces
      5. 13.1.5 Crosstalk and Ground Bounce Minimization
    2. 13.2 Layout Example
  14. 14Device and Documentation Support
    1. 14.1 Device Support
      1. 14.1.1 Third-Party Products Disclaimer
      2. 14.1.2 Other LVDS Products
    2. 14.2 Documentation Support
      1. 14.2.1 Related Information
    3. 14.3 Related Links
    4. 14.4 Trademarks
    5. 14.5 Electrostatic Discharge Caution
    6. 14.6 Glossary
  15. 15Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
  • DGK|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

14 Device and Documentation Support

14.1 Device Support

14.1.1 Third-Party Products Disclaimer

TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.

14.1.2 Other LVDS Products

For other products and application notes in the LVDS and LVDM product families visit our Web site at http://www.ti.com/sc/datatran.

14.2 Documentation Support

14.2.1 Related Information

IBIS modeling is available for this device. Contact the local TI sales office or the TI Web site at www.ti.com for more information.

For more application guidelines, see the following documents:

  • Low-Voltage Differential Signaling Design Notes (SLLA014)
  • Interface Circuits for TIA/EIA-644 (LVDS) (SLLA038)
  • Reducing EMI With LVDS (SLLA030)
  • Slew Rate Control of LVDS Circuits (SLLA034)
  • Using an LVDS Receiver With RS-422 Data (SLLA031)
  • Evaluating the LVDS EVM (SLLA033)

14.3 Related Links

Table 7 lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy.

Table 7. Related Links

PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY
SN65LVDS179 Click here Click here Click here Click here Click here
SN65LVDS180 Click here Click here Click here Click here Click here
SN65LVDS050 Click here Click here Click here Click here Click here
SN65LVDS051 Click here Click here Click here Click here Click here

14.4 Trademarks

Rogers is a trademark of Rogers Corporation.

All other trademarks are the property of their respective owners.

14.5 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

14.6 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.