SLLS881G December   2007  – October 2014 SN65LVDS315

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Handling Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Device Electrical Characteristics
    6. 6.6 Output Electrical Characteristics
    7. 6.7 Input Electrical Characteristics
    8. 6.8 Switching Characteristics
    9. 6.9 Typical Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1 Typical Blanking Power Consumption Test Pattern
    2. 7.2 Maximum Power Consumption Test Pattern
    3. 7.3 Jitter Performance
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Frame Counter Size
      2. 8.3.2 Data Formats
      3. 8.3.3 Parallel Input Port Timing Information
      4. 8.3.4 MIPI CSI-1 / CCP2-Class 0 Interface
      5. 8.3.5 Frame Structure and Synchronization Codes
      6. 8.3.6 Preventing Wrong Synchronization
      7. 8.3.7 Frame Structure
      8. 8.3.8 VS and HS Timing to Generate the Correct Control Signals
    4. 8.4 Device Functional Modes
      1. 8.4.1 Powerdown Modes
        1. 8.4.1.1 Shutdown Mode
        2. 8.4.1.2 Standby Mode
      2. 8.4.2 Active Modes
        1. 8.4.2.1 Acquire Mode (PLL Approaches Lock)
        2. 8.4.2.2 Transmit Mode
      3. 8.4.3 Status Detect and Operating Modes Flow Diagram
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Receiver Termination Requirement
      2. 9.1.2 Preventing Control Inputs From Increased Leakage Currents
    2. 9.2 Typical Application
      1. 9.2.1 VGA Camera Application
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Calculation Example: VGA Camera Sensor
          2. 9.2.1.2.2 Typical Application Frequencies
            1. 9.2.1.2.2.1 8-Bit Camera Application
        3. 9.2.1.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Trademarks
    2. 12.2 Electrostatic Discharge Caution
    3. 12.3 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

13 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.