SLLS881G December   2007  – October 2014 SN65LVDS315

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Handling Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Device Electrical Characteristics
    6. 6.6 Output Electrical Characteristics
    7. 6.7 Input Electrical Characteristics
    8. 6.8 Switching Characteristics
    9. 6.9 Typical Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1 Typical Blanking Power Consumption Test Pattern
    2. 7.2 Maximum Power Consumption Test Pattern
    3. 7.3 Jitter Performance
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Frame Counter Size
      2. 8.3.2 Data Formats
      3. 8.3.3 Parallel Input Port Timing Information
      4. 8.3.4 MIPI CSI-1 / CCP2-Class 0 Interface
      5. 8.3.5 Frame Structure and Synchronization Codes
      6. 8.3.6 Preventing Wrong Synchronization
      7. 8.3.7 Frame Structure
      8. 8.3.8 VS and HS Timing to Generate the Correct Control Signals
    4. 8.4 Device Functional Modes
      1. 8.4.1 Powerdown Modes
        1. 8.4.1.1 Shutdown Mode
        2. 8.4.1.2 Standby Mode
      2. 8.4.2 Active Modes
        1. 8.4.2.1 Acquire Mode (PLL Approaches Lock)
        2. 8.4.2.2 Transmit Mode
      3. 8.4.3 Status Detect and Operating Modes Flow Diagram
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Receiver Termination Requirement
      2. 9.1.2 Preventing Control Inputs From Increased Leakage Currents
    2. 9.2 Typical Application
      1. 9.2.1 VGA Camera Application
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Calculation Example: VGA Camera Sensor
          2. 9.2.1.2.2 Typical Application Frequencies
            1. 9.2.1.2.2.1 8-Bit Camera Application
        3. 9.2.1.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Trademarks
    2. 12.2 Electrostatic Discharge Caution
    3. 12.3 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings(1)

MIN MAX UNIT
Supply voltage range(2) VDDIO –0.3 4 V
VDDD, VDDA –0.3 2.175 V
Voltage range at any output terminal –0.5 2.175 V
Voltage range at any input terminal –0.5 VDDIO + 0.5 V
Continuous power dissipation See Thermal Information
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute maximum- rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to the GND pins.

6.2 Handling Ratings

MIN MAX UNIT
Tstg Storage temperature range –65 150 °C
V(ESD) Electrostatic discharge Human body model(1) (All pins) –3 3 kV
Charged device model(2) (All pins) –500 500 V
Machine model(3) (All pins) –200 200
(1) In accordance with JEDEC Standard 22, Test Method A114-A.
(2) In accordance with JEDEC Standard 22, Test Method C101.
(3) In accordance with JEDEC Standard 22, Test Method A115-A

6.3 Recommended Operating Conditions

Unused single-ended inputs must be held high or low to prevent them from floating.
MIN NOM MAX UNIT
VDDIO
VDDD
VDDA		 Supply voltage 1.65
1.65
1.65		 1.8
1.8		 3.6
1.95
1.95		 V
VDDn(PP) Supply voltage noise magnitude f(VDDn(PP)) = 1 Hz to 2 GHz (test set-up see Figure 13) 100 mV
fDCLK Data clock frequency FSEL = 0, See Figure 16, Figure 17, Figure 18 3.5 13 MHz
FSEL = 1, See Figure 16, Figure 17, Figure 18 7 27
Standby mode (1) 500 kHz
tH x fDCLK DCLK Input duty cycle 0.35 0.65
TA Operating free-air temperature –40 85 °C
tjit(per)DCLK DCLK RMS period jitter(2) Measured on DCLK input 5 ps-rms
tjit(TJ)DCLK DCLK total jitter(3) 0.05/fDCLK s
tjit(CC)DCLK DCLK peak cycle to cycle jitter(4) 0.02/fDCLK s
Icount Number of active video lines(5) MODE = VIH; count the number of HS↓ transitions within one frame 1 2046
thblank Horizontal blanking time 4 UI
(1/DCLK)
tvblank Vertical blanking time 8 UI
(1/DCLK)
DCLK, D[0:1], VS, HS
VIH High-level input voltage See Figure 7 0.7×VDDIO VDDIO V
VIL Low-level input voltage See Figure 7 0 0.3×VDDIO V
tDS Data set up time prior to ↑↓ DCLK See Figure 8 2.0 ns
tDH Data hold time after ↑↓ DCLK See Figure 8 2.0 ns
MODE, TXEN
VIH High-level input voltage See Figure 7 0.7×VDDA 3.6 V
VIL Low-level input voltage See Figure 7 0 0.3×VDDA V
FSEL
VIH High-level input voltage See Figure 7 0.7×VDDD 3.6 V
VIL Low-level input voltage See Figure 7 0 0.3×VDDD V
(1) DCLK input frequencies lower than 500 kHz will force the SN65LVDS315 into standby mode. Input frequencies between 500 kHz and 3 MHz might activate the SN65LVDS315. Input frequencies beyond 3MHz will activate the SN65LVDS315.
(2) Period jitter is the deviation in cycle time of a signal with respect to the ideal period over a random sample of 100,000 cycles.
(3) Total jitter reflects the maximum jitter amplitude observed over a time period of 1012 data bits. It is often derived by adding all deterministic jitter components (ps peak-to-peak values) and the geometric sum of all random components (ps-rms values × 14.069 for 10–12 bit error rate)
(4) Cycle-to-cycle jitter is the variation in cycle time of a signal between adjacent cycles over a random sample of 1,000 adjacent cycle pairs.
(5) For a VGA resolution of 640x480, lcount would be 480

6.4 Thermal Information

THERMAL METRIC(1) SN65LVDS315 UNIT
RGE
24 PINS
RθJA Junction-to-ambient thermal resistance 38.2 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 41.3
RθJB Junction-to-board thermal resistance 16.1
ψJT Junction-to-top characterization parameter 0.9
ψJB Junction-to-board characterization parameter 16.1
RθJC(bot) Junction-to-case (bottom) thermal resistance 6.6
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

6.5 Device Electrical Characteristics

over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP(1) MAX UNIT
IDD Supply current VDDIO = VDDD = VDDA, RL(CLK) = RL(D0) = 100 Ω, VIH=VDDIO, VIL=0V, TXEN and MODE at VDDD, typical blanking power test pattern. See Table 1 FSEL = VIL, fDCLK = 3.5 MHz
FSEL = VIL, fDCLK = 11 MHz
FSEL = VIH, fDCLK = 11 MHz
FSEL = VIH, fDCLK = 26 MHz		 4.8
7.6
5.9
9.6		 mA
VDDIO = VDDD = VDDA, RL(CLK) = RL(D0) = 100 Ω, VIH=VDDIO, VIL=0V, TXEN and MODE at VDDD, Alternating (worst-case) 1010 serial bit pattern. See Table 2 FSEL = VIL, fDCLK = 3.5 MHz
FSEL = VIL, fDCLK = 11 MHz
FSEL = VIH, fDCLK = 11 MHz
FSEL = VIH, fDCLK = 26 MHz		 5.7
8.9
7.2
11.3		 8.1
11.2
9.5
13.3
Standby mode (TXEN at VDD) VDDIO = VDDD = VDDA,
RL(CLK) = RL(D0) = 100 Ω, VIH=VDDIO, VIL=0 V, TXEN and MODE at VDDD, All inputs held static high (VIH) or static low (VIL)		 0.2 10 μA
Shutdown mode (TXEN at GND) 0.2 10
Standby mode (TXEN at VDD) VDDIO = VDDD = VDDA,
RL(CLK) = RL(D0) = 100 Ω, VIH=VDDIO, VIL=0 V, TXEN and Mode = VIL; D[7:0] VS, HS, and DCLK left open		 0.02 10
Shutdown mode (TXEN at GND) 0.03 5
PD Device power dissipation VDDx = 1.8 V, TA = 25°C fDCLK = 3.5 MHz
fDCLK = 11 MHz
fDCLK = 26 MHz		 10.8
17.7
21.2		 mW
VDDx = 1.95 V, TA = –40°C fDCLK = 3.5 MHz
fDCLK = 26 MHz		 15.7
26.0
(1) All typical values are at 25°C and with 1.8 V supply unless otherwise noted.

6.6 Output Electrical Characteristics

over recommended operating conditions (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP(1) MAX UNIT
subLVDS OUTPUTS (DOUT+, DOUT–, CLK+, and CLK–)
VOCM(SS) Steady-state common-mode output voltage See Figure 7, Output load see Figure 11 0.8 0.925 1.0 V
|VOD| Differential output voltage magnitude
|VDOUT+ – VDOUT– |, |VCLK+ – VCLK–|		 100 170 250 mV
Δ|VOD| Change in differential output voltage between logic states –10 10 mV
ZOD Differential small-signal output impedance TXEN at VDD 5 kΩ
IOSD Differential short-circuit output current VOD = 0 V; fDCLK = 26 MHz 1 10 mA
IOZ High-impedance state output current VO = 0 V or VDD(max), TXEN at GND –3 3 μA
(1) All typical values are at 25°C and with 1.8V supply unless otherwise noted.

6.7 Input Electrical Characteristics

over recommended operating conditions (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP(1) MAX UNIT
Dx, VS, HS, DCLK
IIL(hold) Bus hold input current(2) VDDIO = 1.65 V and VDDIO = 3.6 V 15 100 μA
IIH(hold) Bus hold input current(3) VDDIO = 1.65 V and VDDIO = 3.6 V –15 –100 μA
CIN Input capacitance 1.5 pF
MODE, TXEN, FSEL
IIL High-level input current VIH = 0.7 VDDD, See Figure 7 –200 –0.7 200 nA
IIH Low-level input current VIL = 0.3 VDDD, See Figure 7 –200 0.5 200 nA
CIN Input capacitance VI = TBD 1.5 pF
(1) All typical values are at 25°C and with 1.8 V supply unless otherwise noted.
(2) IIL(hold) is the input current the bus-hold input stage is able to source to maintain a low logic level; The bus-hold current becomes minimal as the input approaches GND. IIL(hold) is the least amount of current a camera output must source to overcome the bus hold and force a high signal.
(3) IIH(hold) is the input current the bus-hold input stage is able to source to maintain a high logic level. The bus-hold current becomes minimal as the input approaches VDDIO. IIL(hold) is the least amount of current a camera output must be able source to overcome the bus hold and switch to a low signal.

6.8 Switching Characteristics

over recommended operating conditions (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP(1) MAX UNIT
tr 20%-to-80% differential output signal rise time fDCLK=3.5 MHz, See Figure 10 and Figure 11 360 460 730 ps
tf 20%-to-80% differential output signal fall time fDCLK=3.5 MHz, See Figure 10 and Figure 11 360 460 730 ps
ts(DOUT) Setup time DOUT valid before CLK+ rising edge See Figure 9 FSEL = 0, fDCLK = 13 MHz
FSEL = 1, fDCLK = 26 MHz		 3.327
1.163		 4.2
1.8		 ns
th(DOUT) Hold time DOUT valid before CLK+ ringing edge FSEL = 0, fDCLK = 13 MHz
FSEL = 1, fDCLK = 26 MHz		 4.627
2.463		 5.4
3.0		 ns
tpd(L) Propagation delay time, input to serial output (data latency) TXEN at VDDD, VIH = VDDD, VIL=GND,
RL = 100 Ω, See Figure 12		 4.5/fDCLK 4.7/fDCLK 5.5/fDCLK
tH x fCLKO Output CLK duty cycle 0.45 0.50 0.55
tGS TXEN glitch suppression pulse width(2) VIH = VDDD, VIL=GND, TXEN toggles between VIL and VIH, See Figure 14 3.8 10 μs
tpwnup Enable time from power down (↑TXEN) MODE at VDD; time from TXEDN pulled high to CLK and DOUT outputs enabled and transmit valid data; See Figure 14 100 100μs + 2×VS↑ μs
tpwrdn Disable time from active mode (↓TXEN) TXEN is pulled low during transmit mode; time measurement until output becomes disabled and PLL is shutdown; See Figure 14 11 μs
twakup Enable time from standby (↑↓DCLK) TXEN and MODE at VDD; device in standby; time measurement from DCLK starts switching to CLK and DOUT enabled and transmit valid data; See Figure 15 100 100μs + 2×VS↑ μs
tsleep Disable time from standby (DCLK stopping) TXEN at VDD; device in transmitting; time measurement from DCLK input signal stops starts until CLK + DOUT outputs becomes disabled and PLL is shutdown, See Figure 15 <8/fDCLK 100 μs
(1) All typical values are at 25°C and with 1.8 V supply unless otherwise noted.
(2) The TXEN input incorporates glitch-suppression circuitry to disregard short input pulses. tGS is the duration of either a high-to-low or low-to-high transition that is suppressed.

6.9 Typical Characteristics

vod_f_lls881.gif
FSEL = Low
Figure 1. Differential Output Swing VOD as a Function DCLK Input Frequency vs
vi_cur_lls881.gif
Figure 3. Bus Hold Leakage Current
figure24_lls881.png
The asymmetrical setup and hold time is optimized to meet OMAP processor input timing.
Figure 5. SN65LVDS315 Output Data and Clock Signal at 208 mbps
ccjitt_f_lls881.gif
Figure 2. Cycle-to-Cycle Output Jitter
figure23_lls881.png
Figure 4. SN65LVDS315 Output Data and Clock Signal at 208 mbps (Maximum Speed)
figure25_lls881.png
Through pcb interconnect of 80-inch of FR4 at 208Mbps
Figure 6. SN65LVDS315 Output Clock and Data