SLLSEE8B September   2013  – September 2014 SN65LVDS822

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (Continued)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 Handling Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 DC Electrical Characteristics
    6. 7.6 Power Supply Characteristics
    7. 7.7 Switching Characteristics
    8. 7.8 Typical Characteristics
  8. 8 Parameter Measurement Information
    1. 8.1 Test Patterns
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Unused LVDS Data Lanes
      2. 9.3.2 Tying CMOS Inputs With Resistors
    4. 9.4 Device Functional Modes
      1. 9.4.1 Active Modes
        1. 9.4.1.1 4-Lanes 7-Bit Mode
        2. 9.4.1.2 2-Lanes 14-Bit Mode
      2. 9.4.2 Low-Power Modes
        1. 9.4.2.1 Standby Mode
        2. 9.4.2.2 Shutdown Mode
  10. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Color Bit Mapping
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Power Supply
        2. 10.2.2.2 CMOS Output Bus Connector
        3. 10.2.2.3 Power-Up Sequence
      3. 10.2.3 Application Curve
  11. 11Power Supply Recommendations
    1. 11.1 Decoupling Capacitor Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Trademarks
    2. 13.2 Electrostatic Discharge Caution
    3. 13.3 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Power Supply Recommendations

11.1 Decoupling Capacitor Recommendations

To minimize the power supply noise floor, provide good decoupling near the SN65LVDS822 power pins. It is recommended to place one 0.01-μF ceramic capacitor at each power pin, and two 0.1-μF ceramic capacitors on each power node. The distance between the SN65LVDS822 and capacitors should be minimized to reduce loop inductance and provide optimal noise filtering. Placing the capacitor underneath the SN65LVDS822 on the bottom of the PCB is often a good choice. A 100-pF ceramic capacitor can be put at each power pin to optimize the EMI performance.