SLLSF42A March   2018  – May 2018 SN65LVDS93B-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Simplified Schematic
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 TTL Input Data
      2. 8.3.2 LVDS Output Data
    4. 8.4 Device Functional Modes
      1. 8.4.1 Input Clock Edge
      2. 8.4.2 Low Power Mode
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Power Up Sequence
        2. 9.2.2.2 Signal Connectivity
        3. 9.2.2.3 PCB Routing
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Board Stackup
      2. 11.1.2 Power and Ground Planes
      3. 11.1.3 Traces, Vias, and Other PCB Components
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Trademarks
    2. 12.2 Electrostatic Discharge Caution
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Community Resources
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Functions

DGG Package
56-PIN (TSSOP)
(Top View)

Pin Functions

PIN I/O DESCRIPTION
NAME NO.
CLKIN 31 CMOS IN with pulldn Input pixel clock; rising or falling clock polarity is selectable by Control input CLKSEL.
CLKOUTP 39 LVDS Out Differential LVDS pixel clock output.
Output is high-impedance when SHTDN is pulled low (de-asserted).
CLKOUTM 40
CLKSEL 17 CMOS IN with pulldn Selects between rising edge input clock trigger (CLKSEL = VIH) and falling edge input clock trigger (CLKSEL = VIL).
D5, D6, D7, D8
D9, D10, D11, D12
D13, D14, D15, D16
D17, D18, D19, D20
D21, D22, D23, D24
D25, D26, D27
D0, D1, D2, D3, D4		 2, 3, 4, 6
7, 8, 10, 11
12, 14, 15 , 16
18, 19, 20, 22
23, 24, 25, 27
28, 30, 50
51, 52, 54, 55, 56		 CMOS IN with pulldn Data inputs; supports 1.8 V to 3.3 V input voltage selectable by VDD supply. To connect a graphic source successfully to a display, the bit assignment of D[27:0] is critical (and not necessarily intuitive).
For input bit assignment see to for details.
Note: if application only requires 18-bit color, connect unused inputs D5, D10, D11, D16, D17, D23, and D27 to GND.
GND 5, 13, 21, 29, 33, 35, 36, 43, 49, 53 Power Supply(1) Supply ground for VCC, IOVCC, LVDSVCC, and PLLVCC.
IOVCC 1, 26 Power Supply(1) I/O supply reference voltage (1.8 V up to 3.3 V matching the GPU data output signal swing)
LVDSVCC 44 Power Supply(1) 3.3 V LVDS output analog supply
PLLVCC 34 Power Supply(1) 3.3 V PLL analog supply
SHTDN 32 CMOS IN with pulldn Device shut down; pull low (de-assert) to shut down the device (low power, resets all registers) and high (assert) for normal operation.
VCC 9 Power Supply(1) 3.3 V digital supply voltage
Y0P 47 LVDS Out Differential LVDS data outputs.
Outputs are high-impedance when SHTDN is pulled low (de-asserted)
Y0M 48
Y1P 45
Y1M 45
Y2P 41
Y2M 42
Y3P 37 LVDS Out Differential LVDS Data outputs.
Output is high-impedance when SHTDN is pulled low (de-asserted).
Note: if the application only requires 18-bit color, this output can be left open.
Y3M 38
(1) For a multilayer pcb, it is recommended to keep one common GND layer underneath the device and connect all ground terminals directly to this plane.