SLLS516E August   2002  – July 2015 SN65LVDS100 , SN65LVDS101 , SN65LVDT100 , SN65LVDT101

UNLESS OTHERWISE NOTED, this document contains PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (Continued)
  6. 6 Device Options
  7. 7 Pin Configuration and Functions
  8. 8 Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 ESD Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Thermal Information
    5. 8.5 Electrical Characteristics
    6. 8.6 Switching Characteristics
    7. 8.7 Typical Characteristics
  9. 9 Parameter Measurement Information
  10. 10Detailed Description
    1. 10.1 Overview
    2. 10.2 Functional Block Diagram
    3. 10.3 Feature Description
      1. 10.3.1 Receiver Features
        1. 10.3.1.1 Voltage Range and Common-Mode Range
        2. 10.3.1.2 Sensitivity
        3. 10.3.1.3 Failsafe Considerations
        4. 10.3.1.4 VBB Voltage Reference
        5. 10.3.1.5 Integrated Termination
        6. 10.3.1.6 Receiver Equivalent Schematic
      2. 10.3.2 Driver Features
        1. 10.3.2.1 Signaling Rate, Edge Rate, and Added Jitter
        2. 10.3.2.2 SN65LVDx100 LVDS Output
          1. 10.3.2.2.1 Driver Output Voltage
          2. 10.3.2.2.2 Driver Offset
        3. 10.3.2.3 SN65LVDx101 LVPECL Output
          1. 10.3.2.3.1 Driver Voltage
        4. 10.3.2.4 Driver Equivalent Schematics
    4. 10.4 Device Functional Modes
  11. 11Application and Implementation
    1. 11.1 Application Information
    2. 11.2 Typical Application
      1. 11.2.1 PECL to LVDS Translation
        1. 11.2.1.1 Design Requirements
        2. 11.2.1.2 Detailed Design Requirements
        3. 11.2.1.3 Application Curve
      2. 11.2.2 LVDS to 3.3-V PECL Translation
        1. 11.2.2.1 Design Requirements
        2. 11.2.2.2 Detailed Design Requirements
        3. 11.2.2.3 Application Curve
      3. 11.2.3 5-V PECL to 3.3-V PECL Translation
        1. 11.2.3.1 Design Requirements
        2. 11.2.3.2 Detailed Design Requirements
        3. 11.2.3.3 Application Curve
      4. 11.2.4 CML to LVDS or 3.3-V PECL Translation
        1. 11.2.4.1 Design Requirements
        2. 11.2.4.2 Detailed Design Requirements
        3. 11.2.4.3 Application Curve
      5. 11.2.5 Single-Ended 3.3-V PECL to LVDS Translation
        1. 11.2.5.1 Design Requirements
        2. 11.2.5.2 Detailed Design Requirements
        3. 11.2.5.3 Application Curve
      6. 11.2.6 Single-Ended CMOS to LVDS Translation
        1. 11.2.6.1 Design Requirements
        2. 11.2.6.2 Detailed Design Requirements
        3. 11.2.6.3 Application Curve
      7. 11.2.7 Single-Ended CMOS to 3.3-V PECL Translation
        1. 11.2.7.1 Design Requirements
        2. 11.2.7.2 Detailed Design Requirements
        3. 11.2.7.3 Application Curve
      8. 11.2.8 Receipt of AC-Coupled Signals
        1. 11.2.8.1 Design Requirements
        2. 11.2.8.2 Detailed Design Requirements
        3. 11.2.8.3 Application Curve
  12. 12Power Supply Recommendations
  13. 13Layout
    1. 13.1 Layout Guidelines
      1. 13.1.1 Microstrip vs. Stripline Topologies
      2. 13.1.2 Dielectric Type and Board Construction
      3. 13.1.3 Recommended Stack Layout
      4. 13.1.4 Separation Between Traces
      5. 13.1.5 Crosstalk and Ground Bounce Minimization
    2. 13.2 Layout Example
  14. 14Device and Documentation Support
    1. 14.1 Related Links
    2. 14.2 Community Resources
    3. 14.3 Trademarks
    4. 14.4 Electrostatic Discharge Caution
    5. 14.5 Glossary
  15. 15Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
  • DGK|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

14 Device and Documentation Support

14.1 Related Links

The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy.

Table 3. Related Links

PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY
SN65LVDS100 Click here Click here Click here Click here Click here
SN65LVDT100 Click here Click here Click here Click here Click here
SN65LVDS101 Click here Click here Click here Click here Click here
SN65LVDT101 Click here Click here Click here Click here Click here

14.2 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

14.3 Trademarks

E2E is a trademark of Texas Instruments.

Rogers is a trademark of Rogers Corporation.

All other trademarks are the property of their respective owners.

14.4 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

14.5 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.