SLLS902A February   2010  – March 2024 SN65MLVD040

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  Reccommended Operationg Conditions
    3. 5.3  Thermal Characteristics
    4. 5.4  Package Dissipation Ratings
    5. 5.5  Device Electrical Characteristics
    6. 5.6  Driver Electrical Characteristics
    7. 5.7  Reciver Electrical Charecteristics
    8. 5.8  Bus Input and Output Electrical Characteristics
    9. 5.9  Driver Switching Characterisitics
    10. 5.10 Reciever Switching Charecteristics
    11. 5.11 Typical Characteristics
  7. 6 Paramater Measurement Information
    1. 6.1 Equivalent Input and Output Schematic Diagrams
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Source Synchronous System Clock (SSSC)
        1. 7.1.1.1 Live Insertion/Glitch-Free Power Up/Down
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.1 Absolute Maximum Ratings

over operating free-air temperature range unless otherwise noted(1)
SN65MLVD040
Supply voltage range(2), VCC–0.5 V to 4 V
Input voltage rangeD, DE, RE, FSEN–0.5 V to 4 V
A, B–1.8 V to 4 V
Output voltage rangeR–0.3 V to 4 V
A, or B–1.8 V to 4 V
Electrostatic dischargeHuman Body Model(3)All pins±7 kV
Charged-Device Model(4)All pins±1500 V
Storage temperature range–65°C to 150°C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values, except differential I/O bus voltages, are with respect to network ground terminal.
(3) Tested in accordance with JEDEC Standard 22, Test Method A114-E. Bus pin stressed with respect to a common connection of GND and VCC
(4) Tested in accordance with JEDEC Standard 22, Test Method C101-D.