SLLS902A February   2010  – March 2024 SN65MLVD040

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  Reccommended Operationg Conditions
    3. 5.3  Thermal Characteristics
    4. 5.4  Package Dissipation Ratings
    5. 5.5  Device Electrical Characteristics
    6. 5.6  Driver Electrical Characteristics
    7. 5.7  Reciver Electrical Charecteristics
    8. 5.8  Bus Input and Output Electrical Characteristics
    9. 5.9  Driver Switching Characterisitics
    10. 5.10 Reciever Switching Charecteristics
    11. 5.11 Typical Characteristics
  7. 6 Paramater Measurement Information
    1. 6.1 Equivalent Input and Output Schematic Diagrams
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Source Synchronous System Clock (SSSC)
        1. 7.1.1.1 Live Insertion/Glitch-Free Power Up/Down
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.3 Thermal Characteristics

PARAMETERTEST CONDITIONSMINTYPMAXUNIT
RθJBJunction-to-board thermal resistance9°C/W
RθJCJunction-to-case thermal resistance20°C/W
RθJPJunction-to-pad thermal resistance1.37°C/W
PDDevice power dissipation (See typical curves for additional information)REat 0 V, DE at 0 V, CL = 15 pF, VID = 400 mW, 125 MHz, All others open382mW