SLLS902A February   2010  – March 2024 SN65MLVD040

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  Reccommended Operationg Conditions
    3. 5.3  Thermal Characteristics
    4. 5.4  Package Dissipation Ratings
    5. 5.5  Device Electrical Characteristics
    6. 5.6  Driver Electrical Characteristics
    7. 5.7  Reciver Electrical Charecteristics
    8. 5.8  Bus Input and Output Electrical Characteristics
    9. 5.9  Driver Switching Characterisitics
    10. 5.10 Reciever Switching Charecteristics
    11. 5.11 Typical Characteristics
  7. 6 Paramater Measurement Information
    1. 6.1 Equivalent Input and Output Schematic Diagrams
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Source Synchronous System Clock (SSSC)
        1. 7.1.1.1 Live Insertion/Glitch-Free Power Up/Down
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Pin Configuration and Functions

SN65MLVD040 RGZ Package(Top View) Figure 4-1 RGZ Package(Top View)
Table 4-1 Pin Functions
PIN I/O DESCRIPTION
NAME NO.
1D–4D 35, 32, 28, 25 I Data inputs for drivers
1R–4R 36, 33, 29, 26 O Data output for receivers
1A–4A 47, 3, 9, 13 Bus I/O M-LVDS bus non-inverting input/output
1B–4B 48, 4, 10, 14 Bus I/O M-LVDS bus inverting input/output
GND 6, 7, 18, 23, 27, 31, 34, 38, 43 Circuit ground. ALL GND pins must be connected to ground.
VCC 2, 11, 15, 16, 24, 37, 45, 46 Supply voltage. ALL VCC pins must be connected to supply.
1RE– 4RE 40, 42, 19, 21 I Receiver enable, active low, enable individual receivers. When this pin is left floating, internally this pin will be pulled to logic HIGH.
1DE–4DE 1, 5, 8, 12 I Driver enable, active high, individual enables the drivers. When this pin is left floating, internally this pin will be pulled to logic LOW.
1FSEN–4FSEN 39, 41, 20, 22 I Failsafe enable pin. When this pin is left floating, internally this pin will be pulled to logic HIGH.
This pin enables the Type 2 receiver for the respective channel.
xFSEN = L → Type 1 receiver inputs
xFSEN = H → Type 2 receiver inputs
PDN 30 I Power Down pin. When this pin is left floating, internally this pin will be pulled to logic LOW.
When PDN is HIGH, the device is powered up.
When PDN is LOW, the device overrides all other control and powers down. All outputs are Hi-Z.
NC 17 Not Connected
NC 44 Not Connected. Internal TI Test pin. This pin must be left unconnected.
PowerPAD™ – Connected to GND
Table 4-2 Device Function Tables
RECEIVER DRIVER
INPUTS(1) RECEIVER TYPE OUTPUT(1) INPUTS(1) OUTPUTS(1)
VID = VA – VB PDN FSEN RE R D DE A B
VID > 35 mV H L L Type 1 H L H L H
–35 mV ≤ VID ≤ 35 mV H L L Type 1 ? H H H L
VID < 35 mV H L L Type 1 L OPEN H L H
X OPEN Z Z
VID > 135 mV H H L Type 2 H X L Z Z
65 mV ≤ VID ≤ 135 mV H H L Type 2 ?
VID < 65 mV H H L Type 2 L
Open Circuit H L L Type 1 ?
Open Circuit H H L Type 2 L
X H X H X Z
X H X OPEN X Z
X L X X X Z
(1) H=high level, L=low level, Z=high impedance, X=Don’t care, ?=indeterminate