SLLS573E December   2003  – March 2024 SN65MLVD200A , SN65MLVD202A , SN65MLVD204A , SN65MLVD205A

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Electrical Characteristics – Driver
    7. 6.7  Electrical Characteristics – Receiver
    8. 6.8  Electrical Characteristics – BUS Input and Output
    9. 6.9  Switching Characteristics – Driver
    10. 6.10 Switching Characteristics – Receiver
    11. 6.11 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Power-On Reset
      2. 8.3.2 ESD Protection
    4. 8.4 Device Functional Modes
      1. 8.4.1 Device Function Tables
      2. 8.4.2 Equivalent Input and Output Schematic Diagrams
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1  Supply Voltage
        2. 9.2.2.2  Supply Bypass Capacitance
        3. 9.2.2.3  Driver Input Voltage
        4. 9.2.2.4  Driver Output Voltage
        5. 9.2.2.5  Termination Resistors
        6. 9.2.2.6  Receiver Input Signal
        7. 9.2.2.7  Receiver Input Threshold (Failsafe)
        8. 9.2.2.8  Receiver Output Signal
        9. 9.2.2.9  Interconnecting Media
        10. 9.2.2.10 PCB Transmission Lines
      3. 9.2.3 Application Curves
  11. 10Power Supply Recommendations
  12. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Microstrip Versus Stripline Topologies
      2. 11.1.2 Dielectric Type and Board Construction
      3. 11.1.3 Recommended Stack Layout
      4. 11.1.4 Separation Between Traces
      5. 11.1.5 Crosstalk and Ground Bounce Minimization
      6. 11.1.6 Decoupling
    2. 11.2 Layout Example
  13. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  14. 13Revision History
  15. 14Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • Low-Voltage Differential 30Ω to 55Ω Line Drivers and Receivers for Signaling Rates (1) up to
    100Mbps, Clock Frequencies up to 50MHz
  • Type-1 Receivers Incorporate 25mV of Hysteresis (SN65MLVD200A, SN65MLVD202A)
  • Type-2 Receivers Provide an Offset (100mV) Threshold to Detect Open-Circuit and Idle-Bus Conditions (SN65MLVD204A, SN65MLVD205A)
  • Meets or Exceeds the M-LVDS Standard
    TIA/EIA-899 for Multipoint Data Interchange
  • Controlled Driver Output Voltage Transition Times for Improved Signal Quality
  • –1V to 3.4V of Common-Mode Voltage Range Allows Data Transfer With 2V of Ground Noise
  • Bus Pins High Impedance When Disabled
    or VCC ≤ 1.5V
  • 200Mbps Devices Available (SN65MLVD201, SN65MLVD203, SN65MLVD206, SN65MLVD207)
  • Bus Pin ESD Protection Exceeds 8kV
  • Packages Available:
    • 8-Pin SOIC
      SN65MLVD200A, SN65MLVD204A
    • 14-Pin SOIC
      SN65MLVD202A, SN65MLVD205A
  • Improved Alternatives to the SN65MLVD200, SN65MLVD202A, SN65MLVD204A, and SN65MLVD205A Devices
1. The signaling rate of a line, is the number of voltage transitions that are made per second expressed in the units bps (bits per second)