SLLS573E December   2003  – March 2024 SN65MLVD200A , SN65MLVD202A , SN65MLVD204A , SN65MLVD205A

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Electrical Characteristics – Driver
    7. 6.7  Electrical Characteristics – Receiver
    8. 6.8  Electrical Characteristics – BUS Input and Output
    9. 6.9  Switching Characteristics – Driver
    10. 6.10 Switching Characteristics – Receiver
    11. 6.11 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Power-On Reset
      2. 8.3.2 ESD Protection
    4. 8.4 Device Functional Modes
      1. 8.4.1 Device Function Tables
      2. 8.4.2 Equivalent Input and Output Schematic Diagrams
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1  Supply Voltage
        2. 9.2.2.2  Supply Bypass Capacitance
        3. 9.2.2.3  Driver Input Voltage
        4. 9.2.2.4  Driver Output Voltage
        5. 9.2.2.5  Termination Resistors
        6. 9.2.2.6  Receiver Input Signal
        7. 9.2.2.7  Receiver Input Threshold (Failsafe)
        8. 9.2.2.8  Receiver Output Signal
        9. 9.2.2.9  Interconnecting Media
        10. 9.2.2.10 PCB Transmission Lines
      3. 9.2.3 Application Curves
  11. 10Power Supply Recommendations
  12. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Microstrip Versus Stripline Topologies
      2. 11.1.2 Dielectric Type and Board Construction
      3. 11.1.3 Recommended Stack Layout
      4. 11.1.4 Separation Between Traces
      5. 11.1.5 Crosstalk and Ground Bounce Minimization
      6. 11.1.6 Decoupling
    2. 11.2 Layout Example
  13. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  14. 13Revision History
  15. 14Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|14
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.2.1 Design Requirements

For this design example, use the parameters listed in Table 9-1.

Table 9-1 Design Parameters
PARAMETERSVALUES
Driver supply voltage3 V to 3.6 V
Driver input voltage0.8 V to 3.3 V
Driver signaling rateDC to 100 Mbps
Interconnect characteristic impedance (differential)100 Ω
Termination resistance100 Ω
Number of receiver nodes2 to 32
Receiver supply voltage3 V to 3.6 V
Receiver input voltage0 to (VCC – 0.8) V
Receiver signaling rateDC to 100 Mbps
Ground shift between driver and receiver±1 V